Surface effect induced Cu-Cu bonding by Cu nanosolder paste

被引：43

作者：

Li, J. J. ^{[1
]}

Cheng, C. L. ^{[1
]}

Shi, T. L. ^{[1
,2
]}

Fan, J. H. ^{[1
]}

Yu, X. ^{[1
]}

Cheng, S. Y. ^{[1
]}

Liao, G. L. ^{[1
,2
]}

Tang, Z. R. ^{[1
,2
]}

机构：

[1] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, 1037 Luoyu Rd, Wuhan, Peoples R China

[2] Huazhong Univ Sci & Technol, Wuhan Natl Lab Optoelect, Wuhan, Peoples R China

来源：

MATERIALS LETTERS | 2016年 / 184卷

关键词：

Cu-Cu bonding; Nanoparticles; Nanosolder paste; Surface effect; Sintering; TEMPERATURE; CREEP;

D O I：

10.1016/j.matlet.2016.08.085

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Based on surface effect of nanoparticles, excellent Cu-Cu bonding was achieved by sintering of Cu nanosolder paste. The surface melting behavior of nanoparticles and the bonding process was investigated at the temperature of 250 degrees C to 400 degrees C under the protection of Argon/Hydrogen gas mixtures. The antioxidative Cu nanoparticles were synthesized with high yield by an efficient method for the preparation of solder paste. The bonding achieved by thermo-compression shows great tolerance to experimental environment and the roughness of bonding substrates. The largest shear strength in this study could exceed 35 MPa, which is suitable for high-density packaging of three-dimensional integrated circuits. (C) 2016 Elsevier B.V. All rights reserved.

引用

页码：193 / 196

页数：4

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