A Broadband 22 nm FDSOI D-Band Power Amplifier with Dynamic Back Gate Bias Gain-Linearization Achieving 9.6% PAE at 8.7 dBm OP1dB and 3.7% at 6 dB Back-off

被引:1
作者
Engelmann, Andre [1 ]
Scheller, Kai [1 ]
Probst, Florian [1 ]
Koch, Manuel [1 ]
Weigel, Robert [1 ]
Fischer, Georg [1 ]
机构
[1] Friedrich Alexander Univ Erlangen Nurnberg, Inst Elect Engn, Erlangen, Germany
来源
2024 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, IMS 2024 | 2024年
关键词
Back-gate; D-band; dynamic bias; FDSOI; linearization; power back-off; PAE; power amplifier (PA);
D O I
10.1109/IMS40175.2024.10600283
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work presents a high-efficiency four-stage D-band power amplifier (PA) in a 22nm FDSOI technology. The PA incorporates a dynamic biasing scheme that utilizes the SOI transistor's back-gate terminal to optimize the DC power consumption of each stage based on the corresponding input envelope power level. This dynamic bias control significantly improves the linearity and efficiency in the linear and power compression range. The work describes the associated power detectors and the design of a stacked FET output stage used for output power enhancement. Low-k stacked transformers are employed as interstage matching elements to broaden the bandwidth. The PA achieves 24.5 dB gain, covering a 3-dB bandwidth of 36 GHz centered at 138 GHz. Saturated output power and OP1dB of 10.8dBm and 8.6dBm at nominal supply voltage of 1.6/0.8V is reached while only occupying a core area of 0.045 mm(2). Achieving 9.6% PAE at OP1dB and 3.7% at 6-dB power back-off, the PA demonstrates significant improvement compared to reported D-band PAs in CMOS technology.
引用
收藏
页码:1077 / 1080
页数:4
相关论文
共 10 条
[1]  
Engelmann A, 2022, EUR MICROW INTEGRAT, P212, DOI 10.23919/EuMIC54520.2022.9923463
[2]   A 3-Stacked 10.2 dBm OP1dB D-Band Power Amplifier in 22 nm FDSOI for 6G Communication [J].
Huang, Tianzhu ;
Engelmann, Andre ;
Hetterle, Philip ;
Probst, Florian ;
Weigel, Robert .
2023 ASIA-PACIFIC MICROWAVE CONFERENCE, APMC, 2023, :312-314
[3]  
Li SH, 2022, EUR MICROW INTEGRAT, P248, DOI 10.23919/EuMIC54520.2022.9922964
[4]  
Ong SN, 2018, IEEE RAD FREQ INTEGR, P72, DOI 10.1109/RFIC.2018.8429035
[5]  
Philippe B, 2020, ISSCC DIG TECH PAP I, P374, DOI [10.1109/isscc19947.2020.9062920, 10.1109/ISSCC19947.2020.9062920]
[6]   A Dual-Channel 15 Gb/s PRBS Generator for a D-Band PMCW Radar Transmitter in 22 nm FDSOI [J].
Probst, Florian ;
Engelmann, Andre ;
Koch, Manuel ;
Weigel, Robert .
2023 IEEE WIRELESS AND MICROWAVE TECHNOLOGY CONFERENCE, WAMICON, 2023,
[7]   A 22nm FD-SOI CMOS 2-way D-band Power Amplifier Achieving PAE of 7.7% at 9.6dBm OP1dB and 3.1% at 6dB Back-off by Leveraging Adaptive Back-Gate Bias Technique [J].
Rahimi, Elham ;
Bozorgi, Farhad ;
Hueber, Gernot .
2022 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM (RFIC), 2022, :175-178
[8]  
Simic D, 2018, IEEE RAD FREQ INTEGR, P232, DOI [10.1109/rfic.2018.8428981, 10.1109/RFIC.2018.8428981]
[9]   Design and Analysis of a 140-GHz T/R Front-End Module in 22-nm FD-SOI CMOS [J].
Tang, Xinyan ;
Nguyen, Johan ;
Mangraviti, Giovanni ;
Zong, Zhiwei ;
Wambacq, Piet .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2022, 57 (05) :1300-1313
[10]   A 120-150 GHz Power Amplifier in 28-nm CMOS Achieving 21.9-dB Gain and 11.8-dBm Psat for Sub-THz Imaging System [J].
Zhang, Jincheng ;
Wu, Tianxiang ;
Nie, Lihe ;
Ma, Shunli ;
Chen, Yong ;
Ren, Junyan .
IEEE ACCESS, 2021, 9 :74752-74762