CFD simulation of novel adaptive pin-fins microchannel heat sink to improve thermal management of electronic chips

Frequent hotspots pose a significant challenge for chip thermal management. Conventional microchannel with fixed structure cannot deal with random hotspots, which appear in irregular time and space. To address random hotspots and reduce microchannel energy consumption, a novel adaptive pin-fins microchannel (A-MCHS) is proposed in this paper to intelligently tackle with the hotspot region, which consists of a number of pin-fins with property of phase transition and volume shrinkage when the temperature is raised to 313.15 K. A CFD method is applied to study its thermal performance and user defined function (UDF) is used to realize the adaptive thermal response of pin-fins. It's found that the adaptive pin-fins of the hotspot undergo volume reduction and enlarged local coolant flow under higher hotspot heat flux, illustrating the automatic and adaptive flow regulation effect. Compared with the fixed pin-fin microchannel, the local heat transfer performance of A-MCHS in the hotspot region is enhanced by 37.9 %, average Nu of the microchannel is advanced by 7.4 %, and the maximum chip surface temperature is reduced by up to 3.12 K. Moreover, it also shows a significant reduction of 10.7 % in pressure drop, suggesting a great energy saving in pumping cooling fluid. It's indicated that the adaptive pin-fins microchannel provides efficient cooling and intelligently enhanced thermal management and energy saving for high heat flux electronic chips.