Metaconductor-Based Integrated Array Antenna for High-Efficiency Millimeter-Wave Wireless Communications and Radar Applications

被引:0
作者
Kim, Hae-In [1 ]
Wilcher, Alexander [1 ]
Lee, Woosol [1 ]
Jaime, Joshua M. [2 ]
Otts, Daniel [2 ]
Nelson, Shelby [3 ]
Yoon, Yong-Kyu [1 ]
机构
[1] Univ Florida, Dept Elect & Comp Engn, Gainesville, FL 32611 USA
[2] Univ Florida, Florida Appl Res Engn FLARE, Gainesville, FL 32614 USA
[3] Mosa Microsyst Inc, Rochester, NY 14650 USA
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2024年 / 14卷 / 06期
关键词
Antenna arrays; Antenna measurements; Substrates; Radar antennas; Horn antennas; Antenna feeds; Radio frequency; 5G; antenna-in-packaging (AiP); array antenna; fused silica (FS); metaconductor (MC); millimeter wave (mm-wave); PACKAGE;
D O I
10.1109/TCPMT.2024.3402103
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This letter presents a highly efficient 64-element integrated antenna array for millimeter-wave (mm-wave) communication and radar applications. The antenna uses a metaconductor (MC) made of copper (Cu) and cobalt (Co) to reduce radio frequency (RF) conductor losses. It also uses a double-layered fused silica (FS) stack to minimize the dielectric loss and enhance the fractional bandwidth (FBW). A simulation analysis explored the feasibility of improving antenna realized gain, and prototypes of solid Cu and Cu/Co MC were fabricated using microfabrication and thermal compression-bonding techniques. Characterization was performed using two approaches: 1) s-parameter analysis with a performance network analyzer (PNA), a horn antenna, and the fabricated antennas between 26.5 and 29.5 GHz; and 2) Doppler radar analysis with an RF transceiver, a horn antenna, and the fabricated antennas at 28 GHz. The fabricated MC antenna shows 7% 10-dB FBW and a peak realized gain 9 dB higher than the Cu counterpart at 28 GHz.
引用
收藏
页码:1134 / 1137
页数:4
相关论文
共 13 条
  • [1] Ashraf Nadeem, 2021, 2021 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (APS/URSI), P1053, DOI 10.1109/APS/URSI47566.2021.9704811
  • [2] Highly Energy-Efficient Metaconductor-Based Integrated RF Passives: Metaconductor-Based RF Passives
    Bowrothu, Renuka
    Kim, Hae-in
    Lee, Woosol
    Clingenpeel, Timothy
    Yoon, Yong Kyu
    [J]. IEEE MICROWAVE MAGAZINE, 2022, 23 (08) : 83 - 93
  • [3] High-Radiation Efficiency in Array Antennas Using Cu/Co Metaconductors
    Bowrothu, Renuka
    Kim, Hae-In
    Hwangbo, Seahee
    Yoon, Yong Kyu
    [J]. IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2021, 69 (11) : 7993 - 7998
  • [4] Novel Coupling Cancellation Method by Loading Planar Path for Wideband High-Isolation Wide-Scanning Millimeter-Wave Phased Array
    Gu, Lizheng
    Yang, Wanchen
    Liao, Shaowei
    Xue, Quan
    Che, Wenquan
    [J]. IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2022, 70 (11) : 10520 - 10530
  • [5] Antenna-in-Package Integration for a Wideband Scalable 5G Millimeter-Wave Phased-Array Module
    Gu, Xiaoxiong
    Liu, Duixian
    Hasegawa, Yuta
    Masuko, Koichiro
    Baks, Christian
    Suto, Yuki
    Fujisaku, Yoshiharu
    Sadhu, Bodhisatwa
    Paidimarri, Arun
    Guan, Ning
    Valdes-Garcia, Alberto
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021, 31 (06) : 682 - 684
  • [6] Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond
    Gu, Xiaoxiong
    Liu, Duixian
    Sadhu, Bodhisatwa
    [J]. IEEE JOURNAL OF MICROWAVES, 2021, 1 (01): : 123 - 134
  • [7] Cu/Co metaconductor based coplanar waveguide with sub 0.1 dB/mm insertion loss at 28 GHz
    Kim, Hae-In
    Bowrothu, Renuka
    Yoon, Yong-Kyu
    [J]. 2021 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2021, : 689 - 692
  • [8] Differential-Fed Magneto-Electric Dipole Antenna With Integrated Balun Based on Ball Grid Array Packaging
    Liu, Xiubo
    Zhang, Wei
    Hao, Dongning
    Liu, Yanyan
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (06): : 981 - 987
  • [9] mosaicmicro, 2023, Mosaic Microsystem Viaffirm? Bond
  • [10] The More (Antennas), the Merrier: A Survey of Silicon-Based mm-Wave Phased Arrays Using Multi-IC Scaling
    Sadhu, Bodhisatwa
    Gu, Xiaoxiong
    Valdes-Garcia, Alberto
    [J]. IEEE MICROWAVE MAGAZINE, 2019, 20 (12) : 32 - 50