Foundry compatible, efficient wafer-scale manufacturing of ultra-low loss, high-density Si3N4 photonic integrated circuits

被引：0
|
作者：
Ji, Xinru [1 ,2 ]
Wang, Rui Ning [1 ,2 ]
Liu, Yang [1 ,2 ]
Riemensberger, Johann [1 ,2 ]
Qiu, Zheru [1 ,2 ]
Kippenberg, Tobias J. [1 ,2 ]
机构：
[1] Swiss Fed Inst Technol Lausanne EPFL, Inst Phys, CH-1015 Lausanne, Switzerland
[2] Ecole Polytech Fed Lausanne, Ctr Quantum Sci & Engn, CH-1015 Lausanne, Switzerland
来源：
2024 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION, OFC | 2024年
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We demonstrate ultra-low propagation loss, lithographic precision, and wafer-scale manufacturing for high-density Si3N4 photonic integrated circuits using an efficient DUV-based subtractive approach. We show a propagation loss as low as 1.4 dB/m at 1.55 mu m. (c) 2023 The Author(s)
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页数：3
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