Electrodeposition of a 3D dendritic Cu-Sn bimetallic alloy for electrocatalytic nitrate reduction to ammonia

被引:1
|
作者
Zhao, Jinxiu [1 ,2 ]
Xu, Jingyi [3 ]
Shi, Liyi [1 ]
机构
[1] Shanghai Univ, Emerging Ind Inst, Jiaxing 314050, Zhejiang, Peoples R China
[2] Univ Jinan, Sch Mat Sci & Engn, Jinan 250022, Peoples R China
[3] Shandong Genyuan New Mat Co Ltd, Weihai 264400, Shandong, Peoples R China
关键词
NANOARRAYS; FOAM;
D O I
10.1039/d4nj02343a
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The development of effective and selective catalysts is the key to improving the multi-electron transfer nitrate reduction reaction (NO3-RR) to ammonia (NH3). Herein, we prepared a copper-tin bimetallic alloy using the dynamic hydrogen bubble template electrodeposition technique for electrocatalytic NO3- reduction to NH3. The NH3 yield rate and the faraday efficiency were up to 293.12 mu mol h-1 cm-2 and 78.57% at -1.2 V versus reversible hydrogen electrode in 0.1 M Na2SO4 (containing 0.01 M NaNO3) electrolyte. This paper will provide new suggestions for the use of bimetallic alloys for electrochemical removal of nitrate and ammonia synthesis from water. Cu-Sn alloy attains an NH3 yield rate and faraday efficiency up to 293.12 mu mol h-1 cm-2 and 78.57% at -1.2 V versus reversible hydrogen electrode in 0.1 M Na2SO4 (containing 0.01 M NaNO3) electrolyte.
引用
收藏
页码:13233 / 13237
页数:5
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