Optimization and Research on Warpage of Ultra-thin Substrate

The rigidity of ultra-thin substrate is very small, and they are very sensitive to material selection and matching. During product processing, they are prone to warping and deformation, leading to failure forms such as solder ball solder joints and short circuits. To ensure the yield of ultra-thin products, reasonable material selection and matching must be carried out. In this paper, aiming at the phenomenon of solder ball solder failure after reflow soldering of an ultra-thin packaging product, the influence of different material selection on the warpage of the ultra-thin product was first compared using the workbench simulation, and then the simulation results were verified by experiments. Unlike the traditional method of equivalent material CTE and elastic modulus, this article uses segmented functions to characterize material characteristics during the simulation process, improving reliability and accuracy, solving the problem of virtual soldering in ultra-thin product, and providing a theoretical basis for optimizing the reliability of ultra-thin packaging products.