3-D printed triple-band metasurface filter based on groove gap waveguide technology

被引:0
|
作者
Gao, Qiyue [1 ]
Zhou, Xin [2 ,3 ]
Huang, Nengcai [1 ]
机构
[1] Nanjing Normal Univ, Sch Elect & Automation Engn, Jiangsu Key Lab 3D Printing Equipment & Mfg, Nanjing 210046, Peoples R China
[2] Univ Macau, Fac Sci & Technol, Dept Elect & Comp Engn, Macau, Peoples R China
[3] Nanjing Normal Univ, Sch Elect & Automat Engn, Nanjing 210046, Peoples R China
关键词
Bandpass filter (BPF); Groove gap waveguide (GGW); Triple; -band; Metasurface; 3-D printing; DESIGN;
D O I
10.1016/j.matdes.2024.113127
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This article proposes a 3-D printed high selectivity triple-band metasurface bandpass filter (BPF) for millimeterwave applications using groove gap waveguide (GGW) technology. Firstly, the metasurface composed of electromagnetic bandgap elements in GGW technology is designed and analyzed. This configuration effectively mitigates radiation and electromagnetic wave leakage. Subsequently, the multimode split-type topology under the resonances of TE102 and TE201 modes is utilized to realize a triple-band bandpass response with a compact circuit size. Additionally, the TE101 mode considered as an extra energy coupling path is used to introduce more transmission zeros (TZs). Finally, the design prototype is fabricated using 3D printing technology. The measured results are in good agreement with the simulated ones, providing an excellent option for mm-wave wireless communication systems.
引用
收藏
页数:6
相关论文
共 50 条
  • [31] Lightweight and Low-Loss 3-D Printed Millimeter-Wave Bandpass Filter Based on Gap-waveguide
    Al-Juboori, Bahaa
    Zhou, Jiafeng
    Huang, Yi
    Hussein, Muaad
    Alieldin, Ahmed
    Otter, William J.
    Klugmann, Dirk
    Lucyszyn, Stepan
    IEEE ACCESS, 2019, 7 : 2624 - 2632
  • [32] Adjustable Triple-Band Triple-Mode Dielectric Waveguide Filter With Multiple Transmission Zeros
    Wang, Zhe
    Wu, Yongle
    Xu, Zuoyu
    Yao, Yuan
    Wang, Weimin
    IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS, 2024, 34 (06): : 619 - 622
  • [33] Compact reconfigurable triple-mode triple-band substrate integrated waveguide bandpass filter
    Mehrabi, Mohammad
    Arsanjani, Arash
    Afrooz, Kambiz
    Tayarani, Majid
    INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING, 2020, 30 (03)
  • [34] A Triple-Band Substrate Integrated Waveguide Antenna Based on Metarnaterials
    Zhang, Yingpeng
    Shen, Dongya
    Li, Xingxing
    Su, Jun
    Dong, Ming
    PROCEEDINGS OF THE 2016 11TH INTERNATIONAL SYMPOSIUM ON ANTENNAS, PROPAGATION AND EM THEORY (ISAPE), 2016, : 85 - 87
  • [35] Terahertz refractive index sensor based on triple-band absorption metasurface
    Liu, Dongming
    Qiu, Shujie
    Wang, Yetong
    Han, Jian
    Liu, Qiang
    Lv, Tingting
    OPTICS COMMUNICATIONS, 2025, 579
  • [36] Design and Realization of a Band Pass Filter at D-band Using Gap Waveguide Technology
    Luis Vazquez-Roy, Jose
    Rajo-Iglesias, Eva
    Ulisse, Giacomo
    Krozer, Viktor
    JOURNAL OF INFRARED MILLIMETER AND TERAHERTZ WAVES, 2022, 43 (9-10) : 845 - 845
  • [37] Design and Realization of a Band Pass Filter at D-band Using Gap Waveguide Technology
    Vazquez-Roy, Jose Luis
    Rajo-Iglesias, Eva
    Ulisse, Giacomo
    Krozer, Viktor
    JOURNAL OF INFRARED MILLIMETER AND TERAHERTZ WAVES, 2020, 41 (12) : 1469 - 1477
  • [38] Design and Realization of a Band Pass Filter at D-band Using Gap Waveguide Technology
    Jose Luis Vazquez-Roy
    Eva Rajo-Iglesias
    Giacomo Ulisse
    Viktor Krozer
    Journal of Infrared, Millimeter, and Terahertz Waves, 2020, 41 : 1469 - 1477
  • [39] Groove Gap Waveguide Filter Based on Horizontally Polarized Resonators for V-Band Applications
    Rezaee, Morteza
    Zaman, Ashraf Uz
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2020, 68 (07) : 2601 - 2609
  • [40] A 3-D Printed Compact Inline Waveguide Filter With Transmission Zeros Based on Strongly Coupled Novel Triple-Post Arrangement
    Haider, Iqram
    Koul, Shiban Kishen
    Basu, Ananjan
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 14 (08): : 1434 - 1440