Recent advances in encapsulation strategies for flexible transient electronics

被引：3

作者：

Han, Won Bae ^{[1
,2
,3
]}

Hwang, Suk-Won ^{[3
,4
,5
]}

Yeo, Woon-Hong ^{[1
,2
,6
,7
,8
]}

机构：

[1] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30024 USA

[2] Georgia Inst Technol, Wearable Intelligent Syst & Healthcare Ctr Inst Ma, Atlanta, GA 30332 USA

[3] Korea Univ, KU KIST Grad Sch Converging Sci & Technol, Seoul 02841, South Korea

[4] Korea Inst Sci & Technol KIST, Biomed Res Inst, Ctr Biomat, Seoul 02792, South Korea

[5] Korea Univ, Dept Integrat Energy Engn, Seoul 02841, South Korea

[6] Georgia Tech, Wallace H Coulter Dept Biomed Engn, Atlanta, GA 30332 USA

[7] Emory Univ, Sch Med, Atlanta, GA 30332 USA

[8] Georgia Inst Technol, Parker H Petit Inst Bioengn & Biosci, Inst Mat, Inst Robot & Intelligent Machines, Atlanta, GA 30332 USA

来源：

FLEXIBLE AND PRINTED ELECTRONICS | 2024年 / 9卷 / 03期

基金：

新加坡国家研究基金会;

关键词：

encapsulations; flexible electronics; transient electronics; biodegradability; biomedical devices; GROWN SILICON DIOXIDE; DISSOLUTION; PRESSURE; SENSORS; DEVICES; LAYERS;

D O I：

10.1088/2058-8585/ad6a6c

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Transient electronics, designed to dissolve, disintegrate, or degrade in a controlled manner after fulfilling their functions without remaining biologically and environmentally harmful byproducts, have emerged as a transformative paradigm with promising applications in temporary biomedical devices, eco-friendly electronics, and security applications. The success of this device development relies significantly on an effective encapsulation to protect their degradable active materials from environmental factors, such as biofluids and water, and secure reliable device functions throughout a desired lifespan. This review article provides an overview of recent advances in various encapsulation strategies for developing flexible, transient electronics. Details include materials selection, key characteristics, water-barrier capabilities, degradation mechanisms, and relevant applications, categorized into inorganic materials, synthetic/natural polymers, and hybrid composites. In addition, our insights into existing challenges and key perspectives for enhancing encapsulation performance are shared.

引用

页数：12

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