The Thermal Transient Measurement for the Carbon Fiber-based Thermal Interface Materials in Electronic Packaging Structures

Although the intrinsic thermal conductivity is merit, carbon fiber based thermal interface material is not confident to be employed as candidates to help dissipating heat generated from the chip timely in electronic packaging structures since the thermal resistance of such materials in the packaging structure should be evaluated first. In this work, thermal transient measurement is applied to learn the thermal properties of the entire packaging structure successfully. Through processing the measurement data into cumulative structure functions and then extracting the valid segment data from it, the thermal resistance of CF-TIM can be learned. By the investigation, it is found that the thermal resistance of CF-TIM is constant under various conditions of driving currents but is affected significantly by the packaging pressure and roughness of contacting material surface. This work can provide a guideline for the similar TIM's thermally analyzation used in electronic package structure.