A Distributed Theory for Contactless Interconnects at Terahertz Frequencies

被引：2

作者：

Jungwirth, Nicholas R. ^{[1
]}

Bosworth, Bryan T. ^{[1
]}

Hagerstrom, Aaron M. ^{[1
]}

Papac, Meagan C. ^{[1
]}

Marksz, Eric J. ^{[1
]}

Cheron, Jerome ^{[1
]}

Smith, Kassiopeia ^{[1
]}

Stelson, Angela C. ^{[1
]}

Feldman, Ari ^{[1
]}

Williams, Dylan F. ^{[1
]}

Long, Christian J. ^{[1
]}

Orloff, Nathan D. ^{[1
]}

机构：

[1] NIST, Boulder, CO 80305 USA

来源：

IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS | 2024年 / 34卷 / 08期

关键词：

Integrated circuit interconnections; Solid modeling; Conductors; Computational modeling; Analytical models; Coplanar waveguides; Predictive models; Analytical model; broadside-coupled coplanar waveguide (CPW); bumpless; distributed circuit model; heterogeneous integration; millimeter-wave technology; COPLANAR WAVE-GUIDES; SIGE AMPLIFIER; GAIN;

D O I：

10.1109/LMWT.2024.3412592

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We test a multimodal analytical model for distributed contactless interconnects by comparing it to 3-D full-wave simulations. In comparison to 3-D simulations, the model offers insight into how the interconnect works and reduces the computational cost of estimating and optimizing the interconnect's performance. The model predicts the performance of four distributed contactless interconnects and finds good agreement between with 3-D simulations up to 1 THz. All the interconnects have less than 1-dB insertion loss in their first pass bands, highlighting the opportunity offered by contactless interconnects.

引用

页码：975 / 978

页数：4