Integration of Surface-Mount Devices in Microsystems Using Tracks Consisting of Nanoparticles

被引:0
|
作者
Mitteramskogler, Tina [1 ]
Fuchsluger, Andreas [1 ]
Ecker, Rafael [1 ]
Lang, Sebastian [1 ]
Wilfinger, Thomas [2 ]
Wille, Robert [3 ]
Jakoby, Bernhard [1 ]
机构
[1] Johannes Kepler Univ Linz, Inst Microelect & Microsensors, A-4040 Linz, Austria
[2] Ernst Wittner GmbH, A-1140 Vienna, Austria
[3] Tech Univ Munich, Chair Design Automat, D-80333 Munich, Germany
关键词
Liquids; Reservoirs; Ink; Substrates; Resistance; Nanoparticles; Fabrication; Sensor systems; integration; laser writing; nanoparticle ink; poly(methyl methacrylate) (PMMA); surface-mount devices (SMDs);
D O I
10.1109/LSENS.2024.3460969
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The success of semiconductor industry, providing a high- volume, high-accuracy fabrication method of sensor chips, has caused sensors to be omnipresent in everyday consumer products. Typically, these sensors are enclosed into sensor packages and further integrated onto printed circuit boards since, for the connection to the outer world, several length scales have to be bridged. In this work, we show how surface-mount devices (SMDs) can be directly integrated onto poly(methyl methacrylate) (PMMA) chips through the use of open microchannels. To this end, the SMDs are directly placed onto structured PMMA plates with open microchannels connecting them to dedicated liquid reservoirs. When introducing conductive inks to those reservoirs, capillary forces draw the liquid toward the SMDs and ensure the electrical connection between the liquid reservoir and the SMDs themselves. With the addition of crossings and meandering conductive lines, this process can be used for the fabrication of electrical networks out of individual SMD components directly on a PMMA substrate.
引用
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页数:4
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