A Dual-Band Mushroom EBG Structure With Inductive via Coupling for Wideband Parallel-Plate Mode Suppression

被引:0
作者
Li, Da-Lin [1 ]
Zhang, Mu-Shui [1 ]
Wang, Zi-Xin [1 ]
机构
[1] Sun Yat sen Univ, Guangzhou Higher Educ Mega Ctr, Sch Elect & Informat Technol, Guangzhou 510006, Peoples R China
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2024年 / 14卷 / 06期
关键词
Periodic structures; Metamaterials; Resonators; Couplings; Couplers; Inductors; Resonant frequency; Electromagnetic bandgap (EBG); power integrity (PI); power noise; GROUND BOUNCE NOISE; IMPEDANCE ELECTROMAGNETIC SURFACES; SIMULTANEOUS SWITCHING NOISE; POWER DISTRIBUTION NETWORK; COMPACT; PLANE; SSN; REDUCTION; DESIGN;
D O I
10.1109/TCPMT.2024.3391349
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A dual-band mushroom electromagnetic bandgap (EBG) structure with inductive via coupling is proposed in this article, in which via coupling is first introduced to generate another new stopband. The principle of how to generate two stopbands is demonstrated by equivalent circuit models with two or more coupling LC series resonators through mutual inductance. Then, a new EBG structure with four-cell inductive via coupling is proposed. Full-wave simulated and measured results show that the four-cell coupling EBG structure introduces two continuous stopbands, which extend the power noise suppression stopband. Finally, an eight-cell via coupling EBG structure is developed to extend the stopband further.
引用
收藏
页码:1060 / 1070
页数:11
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