Advanced Nano Packaging for Silicon Nanowire Sensors

被引：0

作者：

Selvarathinam, Thambiraj ^{[1
]}

Kim, Bruce ^{[1
]}

Lee, Jeong H. ^{[2
]}

Park, Jong W. ^{[2
]}

机构：

[1] CUNY, Grove Sch Engn, 160 Convent Ave, New York, NY 10031 USA

[2] Korea Res Inst Ships & Ocean, Daejeon, South Korea

来源：

2024 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING, NORDPAC 2024 | 2024年

关键词：

silicon nanowire integrated sensor array; optimization of parameters; metal deposition; Packaging; wire bonding;

D O I：

10.23919/NordPac61094.2024.10582264

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper describes the design of a silicon nanowire-based sensor chip and the optimization of parameters and formulas including photolithography and e-beam deposition. We present packaging issues with nanometer-thick metal deposition. The electrical response of the silicon nanowire integrated sensor array is studied using electrical current analysis. The sensors are designed to detect chemicals and biomolecules, potentially acting as novel biosensors for biomedical diagnosis in the future.

引用

页数：5

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