Design Strategies of Nanofillers in Photosensitive Polyimide Nanocomposites

The demand for next-generation photosensitive polyimide (PSPI) is low-temperature curable and low-dielectric properties. In this paper, a curing accelerator (aminoquinoline, AQL) was used to modify submicron fluorinated carbon (FC), and prepared a submicron quinoline modified fluorinated carbon (QL-FCO) nanofiller. QL-FCO can enhance the mechanical and dielectric properties of the nanocomposites, and the quinoline groups on its surface can also promote the curing process of PSPI, so that the low-temperature cured PSPI has excellent comprehensive properties. The QL-FCO/PI cured at 200. have a high imidization degree (>100%), and excellent mechanical, thermal, and dielectric properties, which are better than pure PI cured at 300.. After spin-coating, pre-baking, photolithography, development, and curing, QL-FCO/PSPI can obtain patterns with a resolution of up to 5 mu m. Although there is still a small amount of filler aggregates on the pattern, it does not affect the L/S patterns.