Flexible and high durability aramid Nanofiber/Ti3C2Tx MXene@CuNPs nanocomposite films for superior electromagnetic interference shielding

Higher shielding efficiency and better overall performance are the direction of development for electromagnetic interference (EMI) shielding materials due to the rapid development of electronic information technology. Herein, a novel flexible, lightweight, durable, and high electrical conductivity aramid nanofiber/Ti3C2Tx MXene/ copper nanoparticles (ANF/MXene@CuNPs) nanocomposite film is successfully prepared using the blade-coating method in conjunction with the sol-gel conversion strategy and the electroless mental deposition approach. Without the use of the traditional roughing procedure, in-situ reduction of CuNPs on the film is accomplished by employing a low amount of MXene as the reducing agent, which not only stabilizes the metal nanoparticles but also endows a strong binding force between CuNPs coating and the substrate, significantly improving the conductivity and EMI shielding efficiency. Therefore, the EMI SE of the as-obtained film with 30 min of CuNPs planting can reach 73.8 dB. Moreover, the high-performance ANF soft matrix provides the film with good flexibility, allowing it to be folded into intricate patterns without shattering. Furthermore, the film has exceptional stability and durability due to the strong connection between the substrate and copper plating. The multifunctional ANF/MXene@CuNP films exhibit outstanding potential in high-performance electromagnetic shielding applications.