Review of advances in tool condition monitoring techniques in the milling process

被引:11
作者
Mohanraj, T. [1 ]
Kirubakaran, E. S. [1 ]
Madheswaran, Dinesh Kumar [2 ]
Naren, M. L. [1 ]
Dharshan, Suganithi P. [1 ]
Ibrahim, Mohamed [1 ]
机构
[1] Amrita Vishwa Vidyapeetham, Amrita Sch Engn, Dept Mech Engn, Coimbatore, India
[2] SRM Inst Sci & Technol, Green Vehicle Technol Res Ctr, Kattankulathur Campus, Kattankulathur 603203, Tamil Nadu, India
关键词
tool condition monitoring system; sensors; tool wear; data analytics and algorithms; tool life; SMART CUTTING TOOLS; VIBRATION SIGNALS; ACOUSTIC-EMISSION; WEAR; PREDICTION; SYSTEM; FORCE; MODEL; CONSUMPTION; DESIGN;
D O I
10.1088/1361-6501/ad519b
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Milling is an extremely adaptable process that can be utilized to fabricate a wide range of shapes and intricate 3D geometries. The versatility of the milling process renders it useful for the production of a diverse range of components and products in several industries, including aerospace, automotive, electronics, and medical equipment. Monitoring tool conditions is essential for maintaining product quality, minimizing production downtime, and maximizing tool life. Advances in this field have been driven by the need for increased productivity, reduced tool wear, and improved process efficiency. Tool condition monitoring (TCM) in the milling process is a critical aspect of machining operations. TCM involves assessing the health and performance of cutting tools used in milling machines. As technology evolves, staying updated with the latest developments in this field is essential for manufacturers seeking to optimize their milling operations. However, addressing the challenges associated with sensor integration, data analysis, and cost-effectiveness remains crucial. To fill this research gap, this paper provides an overview of the extensive literature on monitoring milling tool conditions. It summarizes the key focus areas, including tool wear sensors and the application of various machine learning and deep learning algorithms. It also discusses the potential applications of TCM beyond wear detection, such as predicting tool breakage, tool wear, the cutting tool's remaining lifetime, and the challenges faced by TCMs. This review also provides suggestions for potential future research endeavors and is anticipated to offer valuable insights for the development of advanced TCMs in terms of tool wear monitoring and predicting remaining useful life.
引用
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页数:19
相关论文
共 124 条
  • [21] Smart Cutting Tools Used in the Processing of Aluminum Alloys
    Dobrota, Dan
    Racz, Sever-Gabriel
    Oleksik, Mihaela
    Rotaru, Ionela
    Tomescu, Madalin
    Simion, Carmen Mihaela
    [J]. SENSORS, 2022, 22 (01)
  • [22] Elgargni M A., 2015, 2015 IEEE 13 INT C I, V(eds)
  • [23] A novel vibration-based prognostic scheme for gear health management in surface wear progression of the intelligent manufacturing system
    Feng, Ke
    Ji, J. C.
    Ni, Qing
    Li, Yifan
    Mao, Wentao
    Liu, Libin
    [J]. WEAR, 2023, 522
  • [24] A review of vibration-based gear wear monitoring and prediction techniques
    Feng, Ke
    Ji, J. C.
    Ni, Qing
    Beer, Michael
    [J]. MECHANICAL SYSTEMS AND SIGNAL PROCESSING, 2023, 182
  • [25] Vibration-Based System Degradation Monitoring under Gear Wear Progression
    Feng, Ke
    Ni, Qing
    Zheng, Jinde
    [J]. COATINGS, 2022, 12 (07)
  • [26] A novel similarity-based status characterization methodology for gear surface wear propagation monitoring
    Feng, Ke
    Ni, Qing
    Beer, Michael
    Du, Haiping
    Li, Chuan
    [J]. TRIBOLOGY INTERNATIONAL, 2022, 174
  • [27] Vibration-based monitoring and prediction of surface profile change and pitting density in a spur gear wear process
    Feng, Ke
    Smith, Wade A.
    Randall, Robert B.
    Wu, Hongkun
    Peng, Zhongxiao
    [J]. MECHANICAL SYSTEMS AND SIGNAL PROCESSING, 2022, 165
  • [28] Ferguson M, 2018, SMART SUSTAIN MANUF, V2, P40, DOI [10.1520/SSMS20180019, 10.1520/SSMS20180019 ]
  • [29] Ferguson M, 2017, PROC ASME DES ENG TE
  • [30] Geramifard O., 2012, 2012 7 IEEE C IND EL, V(eds)