A Four-Port Noise De-Embedding Methodology for On-Wafer Microwave Device Based on Electromagnetic Simulation

被引:0
|
作者
Feng, Zhiyu [1 ,2 ]
Ding, Wucang [1 ]
Su, Yongbo [1 ]
Feng, Ruize [1 ,2 ]
Zhou, Fugui [1 ]
Gong, Hang [1 ,2 ]
Jin, Zhi [1 ]
机构
[1] Chinese Acad Sci, Inst Microelect, High Frequency High Voltage Device & Integrated Ci, Beijing 100029, Peoples R China
[2] Univ Chinese Acad Sci, Sch Integrated Circuits, Beijing 100029, Peoples R China
来源
IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS | 2024年 / 34卷 / 07期
关键词
Electromagnetic (EM) simulation; four-port de-embedding; InP HEMT; noise de-embedding; noise parameters; HIGH-FREQUENCY NOISE; GENERAL NOISE; PARAMETER;
D O I
10.1109/LMWT.2024.3387992
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This letter presents a four-port noise de-embedding procedure for on-wafer microwave measurements based on electromagnetic (EM) simulation. The proposed de-embedding procedure uses EM simulation dummy structures and only one device measurement to eliminate the parasitic effects from the probe pads and metal interconnects of a device under test (DUT). This method can generate intrinsic noise characteristics parameters to efficiently and precisely remove the redundant parasitic of the DUTs with various device sizes. The accuracy and feasibility of the noise de-embedding method are verified by comparing the de-embedding results of EM simulation, on-wafer testing, and circuit-model-calculated. Finally, we evaluate the accuracy of the de-embedding approach with the traditional approach and experimental data obtained on InP HEMT.
引用
收藏
页码:943 / 946
页数:4
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