Transient Swelling During Development of Poly(methyl methacrylate) Resist

被引:0
作者
Konda, Akihiro [1 ]
Yamamoto, Hiroki [2 ]
Yoshitake, Shusuke [3 ]
Kozawa, Takahiro [1 ]
机构
[1] Osaka Univ, SANKEN, Osaka, Ibaraki 5670047, Japan
[2] Natl Inst Quantum Sci & Technol, Takasaki Adv Radiat Res, Takasaki, Gunma 3701292, Japan
[3] NuFlare Technol Inc, Yokohama, Kanagawa 2358522, Japan
关键词
Main-chain-scission-type resists; EUV; EB; Dissolution kinetics; PMMA; ELECTRON-BEAM LITHOGRAPHY; CHEMICAL AMPLIFICATION; DISSOLUTION BEHAVIOR; FABRICATION; RADIATION; POLYMERS; DYNAMICS; WIRES; LINES;
D O I
暂无
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
For the realization of further miniaturization at scale of 10 nm and below in semiconductor devices, it is essential to understand the dissolution kinetics of resist films in developer. In this study, the change in molecular weight and dissolution kinetics induced by ionizing radiation in poly(methyl methacrylate) (PMMA) resist films were studied using a quartz crystal microbalance method and gel permeation chromatography. The weight -averaged molecular weight M (w) was changed from 50000 to 996000. Three types of developers ( o - xylene and 1:3 and 1:7 mixing solutions of methyl isobutyl ketone and isopropanol) were examined. The kinetics during the development of PMMA films was classified into three patterns. In low M (w) region, only dissolution was observed. In middle M (w) region, both swelling and dissolution were observed. In high M (w) region, only swelling was observed. The boundaries between regions were dependent of the developer and independent of the initial molecular weight of PMMA.
引用
收藏
页码:81 / 88
页数:8
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