Targeted Microforming of Borosilicate Glass Induced by a Laser-Ablation-Free Process Using Femtosecond Pulses

The use of ultrashort pulse lasers opens up a wide range of possibilities for processing dielectric materials. The present study focuses on the investigation of the ablation-free microscopic surface modification of borosilicate glass using femtosecond laser radiation (350 fs at 515 nm wavelength) in a scanning machining process. Furthermore, its aim is to analyze the relationship between the laser process parameters and the microscopic changes in the surface topography observed. The characteristic of the generated surface structure, which takes place below the ablation threshold, shows both elevations and depressions within the irradiated field (2 x 2 mm2). The realized structures reach a profile height Peak-to-Valley (PV) of up to 10 mu m. The amount of surface deformation depends on the selected parameters such as laser fluence, number of passes, and scanning strategy. The microdeformation is detected on both the top and bottom sides of the processed glass material with a thickness <= 1 mm. The influence of the temporal and spatial energy distribution on the material modification is discussed, demonstrating the possibilities of microforming of silicate glasses using ultrashort pulsed laser radiation. The study investigates the possibilities of targeted ablation-free microforming of borosilicate glass using ultrashort pulsed laser radiation. The results show that characteristic "peak-valley" structures with a profile height of up to 10 mu m can be produced on the top and bottom side of 1 mm thick glass substrates. Essential process parameters influencing these microscopic changes are identified. image