Evaluating Free Thermal Expansion and Glass Transition of Ultrathin Polymer Films on Heated Liquid

被引:4
作者
Lee, Tae-Ik [1 ]
Kim, Ji Hun [2 ]
Kim, Dong Jun [2 ]
Kim, Taek-Soo [2 ]
机构
[1] KITECH, Adv Packaging & Integrat Ctr, Joining R&D Grp, Incheon 21999, South Korea
[2] Korea Adv Inst Sci & Technol KAIST, Dept Mech Engn, Daejeon 34141, South Korea
基金
新加坡国家研究基金会;
关键词
coefficient of thermalexpansion; glass transition temperature; digitalimage correlation; liquid surface; thin film; DIGITAL-IMAGE-CORRELATION; HIGH-PERFORMANCE; TEMPERATURE; POLYSTYRENE; INTERFACE; THICKNESS; VISCOELASTICITY; COEFFICIENT; BEHAVIOR;
D O I
10.1021/acsami.4c02279
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Thermomechanical properties of ultrathin films are crucial for fabrication and use of reliable thin electronic devices. Due to the lack of precise measurement techniques, the thermal deformation behavior of ultrathin films has not yet been clarified. Here, we propose a film on heated liquid (FOHL) method to simultaneously measure the coefficient of thermal expansion (CTE) and glass transition temperature (T-g) of multiple ultrathin polymer films. Free thermal expansion of thin films without substrate interaction can be guaranteed when the thin films are afloat on a liquid surface. To investigate the thermal behavior in a wide temperature range, glycerol is adopted as a thermally stable heating platform owing to its high boiling point of 290 degrees C. The thin films are transferred onto the glycerol surface from the water surface using the hygroscopic properties of glycerol. Highly accurate and high-throughput thermal strain measurement is achieved using three-dimensional digital image correlation (3D-DIC). The thermomechanical properties of ultrathin polystyrene thin films of various thicknesses (25-400 nm) are precisely characterized utilizing the FOHL and 3D-DIC method.
引用
收藏
页码:30336 / 30343
页数:8
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