Comprehensive study of plastic deformation mechanism of polycrystalline copper using crystal plasticity finite element

Graded polycrystalline copper materials have been expected in the field of scientific research and engineering in recent years because the core of the material has enough toughness and a sufficient surface strength. However, the plastic deformation mechanism, gradient grain generation mechanism and material strengthening principle of polycrystalline copper are still not well understood. Therefore, it is urgent to further analyze the plastic deformation of polycrystalline copper. In this study, the micron scale plastic deformation behavior of polycrystalline copper is simulated based on the crystal plasticity finite element method. The simulation analysis is carried out from the aspects of grain size, grain shape, crystal orientation type and quantity, loading mode and so on. The effects of the above parameters on the Mises stress nephogram and stress -strain curve of polycrystalline copper were analyzed. At the end of the article, the EBSD orientation distribution information of graded polycrystalline copper grains obtained in the cutting process is analyzed comprehensively and the formation mechanism of graded polycrystalline copper is explained by combining the simulation results.