A novel 3D packaging technology for high-reliability applications

A novel 3D packaging technology for high-reliability applications was proposed in this paper. The Kovar pins were set at the bottom of the module, and the soldering area of the pin and the PCB was increased by several times without increasing the X-Y plane size of the 3D packaging module. So the reliability of electrical connection and mechanical connection between the 3D packaging module and PCB could be significantly improved. A 128Gbit solid-state memory (SSM) module was prepared by the 3D packaging technology, and there were 8 NAND flash dies with a memory capacity of 16 Gbit were stacked in the module. The size of module was 19.2mm x 13.6mm x 3.0 mm, and the weight is only 2.1g. The AC/DC parameter test result met the requirements of the chip datasheet, and the function ran without abnormalities. And the SSM module also passed stable baking (+125 degrees C, 72h), temperature cycling (-55 similar to+125 degrees C,10 times), and constant acceleration (30000g, 1min) environmental tests, which could meet the requirements of high-reliability application.