High energy dissipation composite elastomer for application as a thermal interface material through solvent-induced dis-entanglement

In recent years, miniaturization and integration have become the trend in electronic devices, and the resulting severe thermal bottlenecks cause up to 55% of electronic device failures. The use of functionally filled elastomer composites is the main way to address thermal failures in electronic devices. However, highly filled elastomer composites tend to have brittleness problems. Here, we propose a strategy to optimize the mechanical properties of elastomer composites by solvent-induced disentanglement of molecular chains. The excellent energy dissipation capability of the polymer network after the disentanglement endows the elastomer composites excellent stretchability (450%) and toughness (2.75MJ/m(3)). The enhanced thermal conductivity is assisted by the high filled of thermal conductive fillers (1.66 W m(-1) K-1). We believe that our work can provide new ideas for the development of next-generation high-performance elastomeric composites.