Ultrastable 3D Heterogeneous Integration via N-Heterocyclic Carbene Self-Assembled Nanolayers

被引：4

作者：

Lee, Jinhyoung ^{[1
,2
]}

Woo, Gunhoo ^{[3
,4
]}

Lee, Gyuyoung ^{[1
]}

Jeon, Jongyeong ^{[1
]}

Lee, Seunghwan ^{[1
]}

Wang, Ziyang ^{[1
]}

Shin, Hyelim ^{[5
]}

Lee, Gil-Woo ^{[1
,6
]}

Kim, Yeon-Ji ^{[1
,6
]}

Lee, Do-Hyun ^{[1
,6
]}

Kim, Min-Jae ^{[3
,4
]}

Kim, Eungchul ^{[8
]}

Seok, Hyunho ^{[3
,4
]}

Cho, Jinill ^{[1
]}

Kang, Boseok ^{[3
,4
,7
]}

No, You-Shin ^{[6
]}

Jang, Won-Jun ^{[2
,9
]}

Kim, Taesung ^{[1
,3
,4
,5
,7
]}

机构：

[1] Sungkyunkwan Univ SKKU, Sch Mech Engn, Suwon 16419, Gyeonggi Do, South Korea

[2] Inst Basic Sci IBS, Ctr Quantum Nanosci, Seoul 03760, South Korea

[3] Sungkyunkwan Univ SKKU, Dept SKKU Adv Inst Nanotechnol SAINT, Suwon 16419, Gyeonggi Do, South Korea

[4] Sungkyunkwan Univ, Dept Nano Sci & Technol, Suwon 16419, Gyeonggi Do, South Korea

[5] Sungkyunkwan Univ, Dept Semicond Convergence Engn, Suwon 16419, Gyeonggi Do, South Korea

[6] Konkuk Univ, Dept Phys, Seoul 05029, South Korea

[7] Sungkyunkwan Univ, Dept Nano Engn, Suwon 16419, Gyeonggi Do, South Korea

[8] Samsung Elect, AVP Proc Dev Team, Cheonan Si 31086, Chungcheongnam, South Korea

[9] Ewha Womans Univ, Dept Phys, Seoul 03760, South Korea

来源：

ACS APPLIED MATERIALS & INTERFACES | 2024年

基金：

新加坡国家研究基金会;

关键词：

N-heterocyclic carbenes; Cu/polymer bonding; self-assembly; 3D heterogeneousintegration; chargetransfer; MONOLAYERS; SURFACE; GOLD;

D O I：

10.1021/acsami.4c04665

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The commercialization of 3D heterogeneous integration through hybrid bonding has accelerated, and accordingly, Cu-polymer bonding has gained significant attention as a means of overcoming the limitations of conventional Cu-SiO2 hybrid bonding, offering high compatibility with other fabrication processes. Polymers offer robust bonding strength and a low dielectric constant, enabling high-speed signal transmission with high reliability, but suffer from low thermomechanical stability. Thermomechanical stability of polymers was not achieved previously because of thermal degradation and unstable anchoring. To overcome these limitations, wafer-scale Cu-polymer bonding via N-heterocyclic carbene (NHC) nanolayers was presented for 3D heterogeneous integration, affording ultrastable packing density, crystallinity, and thermal properties. NHC nanolayers were deposited on copper electrodes via electrochemical deposition, and wafer-scale 3D heterogeneous integration was achieved by adhesive bonding at 170 degrees C for 1 min. Ultrastable conductivity and thermomechanical properties were observed by the spatial mapping of conductivity, work function, and force-distance curves. With regard to the characterization of NHC nanolayers, low-temperature bonding, robust corrosion inhibition, enhanced electrical conductivity, back-end-of-line process compatibility, and fabrication process reduction, NHC Cu/polymer bonding provides versatile advances in 3D heterogeneous integration, indicating that NHC Cu/polymer bonding can be utilized as a platform for future 3D vertical chip architectures.

引用

页码：35505 / 35515

页数：11