Cu/Mo/NGs composites: Multilayer interconnected spatial net structure enhanced the mechanical properties

被引:0
|
作者
Gao, Yuan [1 ]
Chen, Wei [1 ]
Fan, Lining [1 ]
Zheng, Hui [1 ]
Guo, Xiaoxiao [1 ]
Zheng, Peng [1 ]
Zheng, Liang [1 ]
Pan, Qingsong [2 ]
Zhang, Yang [1 ]
机构
[1] Hangzhou Dianzi Univ, Dept Elect Sci & Technol, Lab Nanoelect & NanoDevices, Hangzhou 310018, Peoples R China
[2] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
基金
中国国家自然科学基金;
关键词
Accumulative hot-pressing roll bonding; Nitrogen-doped graphene sheet; Copper-molybdenum alloys; Strength; Resistivity; HIGH-STRENGTH; DEFORMATION; BEHAVIOR; MO; CU;
D O I
10.1016/j.ijrmhm.2024.106761
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This study addresses the urgent problem of developing high-performance metal-based conductor materials capable of adapting to complex working environments. A novel method, called Accumulative Hot Pressing Roll Bonding (AHRB), is proposed for fabricating Cu/Mo/NGs multilayer composite materials. Through repetitive cold rolling and hot-pressing operations, nanoscale metal-based layered materials with thicknesses in the range of hundreds of nanometers are successfully obtained. This material features a multilayered interconnected net structure with Mo2C as the core and CuMo alloy as the framework. The layers are dislocated and connected to each other. The mechanical properties of the materials are significantly improved due to heterogeneous strengthening and grain refinement. The material achieves a tensile strength of 854 MPa, while the conductivity remains stable between 55% similar to 60% IACS. The reaction between NGs and Mo leads to the formation of an Mo2C interface, while the hot-pressing operation promotes the formation of a CuMo diffusion interface. These two interfaces enhance the interlayer forces of the composites, thereby improving the material's integrity. The investigation of Cu/Mo/NGs multilayer composite materials presents a novel approach for alloying refractory metals Mo and Cu, offering promising prospects for future engineering applications.
引用
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页数:11
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