Unveiling the Shadows: Overcoming Bottlenecks in Scaling Organic Photovoltaic Technology from Laboratory to Industry

被引:3
作者
Chang, Yi-Ming [1 ]
Hsiao, Yu-Tang [1 ]
Tsai, Kuen-Wei [1 ]
机构
[1] Raynergy Tek Inc, 2F,60,Pk Ave 2,Hsinchu Sci Pk, Hsinchu 30844, Taiwan
关键词
organic electronic; organic photovoltaic; organic solar cell; photovoltaic module; POLYMER SOLAR-CELLS; SMALL MOLECULAR ACCEPTOR; CONJUGATED POLYELECTROLYTE; ZINC-OXIDE; 17-PERCENT EFFICIENCY; ELECTRON-ACCEPTOR; INTERFACIAL LAYER; HIGHLY EFFICIENT; PERFORMANCE; COST;
D O I
10.1002/aenm.202400064
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Organic photovoltaic (OPV) technology has recently achieved remarkable progress in academia, attaining power conversion efficiencies exceeding 19%, a breakthrough previously unimaginable. Despite these advancements, the translation of high-efficiency OPV cells into the commercialization of OPV modules has been limited, impeding the market penetration of OPV technology. Upon careful examination, various challenges emerge, including disparities between laboratory research and industrial production in device architecture, influenced by considerations of cost and manufacturability. Additionally, the incorporation of high-efficiency materials requires careful consideration not only of the compatibility between the photoactive layer and interface layers or transparent electrodes but also of the associated synthetic complexity of chemical structures and cost implications. While these issues are crucial, they may not be widely discussed in current mainstream research. In this article, the purpose is to identify bottlenecks from a material techniques perspective, with the aim of promoting increased resources in the research of pertinent module technologies. This effort is intended to propel OPV technology toward greater success and bring it into closer alignment with the goals of commercialization. As organic photovoltaic technology transitions from the laboratory to module mass production, challenges like variations in device architecture and issues related to material availability have become evident. This article seeks to heighten awareness among researchers in related fields regarding the current industry challenges. Addressing these bottlenecks requires collaborative efforts, serving as the key to propelling the technology toward greater success. image
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页数:18
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