Online Bridge-Level Junction Temperature Evaluation of IGBTs via Emitter Parasitic Inductance Voltage Undershoot

被引:1
|
作者
Fang, Xinbin [1 ]
Sun, Pengju [1 ]
Wang, Bo [2 ]
Luo, Quanming [1 ]
Du, Xiong [1 ]
机构
[1] Chongqing Univ, Sch Elect Engn, State Key Lab Power Transmiss Equipment Technol, Chongqing 400044, Peoples R China
[2] ABB Beijing Drive Syst Co Ltd, Beijing 100000, Peoples R China
基金
中国国家自然科学基金;
关键词
Bridge circuits; Bridge-level; emitter parasitic inductance voltage undershoot; insulated gate bipolar transistor (IGBT); online junction temperature estimation; thermosensitive electrical parameter (TSEP);
D O I
10.1109/TIE.2024.3392995
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Insulated gate bipolar transistor (IGBT) junction temperature evaluation is vital for health assessment. However, most of the existing IGBT junction temperature (T-j) evaluation approaches require the same number of detecting units and IGBTs. In this article, a thermosensitive electrical parameter based on the turn-OFF induced voltage v(eE) undershoot between Kelvin and power emitters of lower IGBT for two IGBTs junction temperatures estimation in half-bridge module is proposed, which is independent of bond wires fatigue. The v(eE) ringing of lower IGBT under designed time sequence has a good linear dependency with T-j of upper and lower IGBTs. An improved peak detector circuit is designed to extract the v(eE) with no disruption to normal operation. Double-pulse test and three-phase converter platforms are built to verify the feasibility of industrial applications. Calibration results show that there is good linearity and high sensitivity between IGBT junction temperature and v(eE) undershoot under various working conditions. Besides, the approach has high accuracy in junction temperature monitoring validated by infrared. Therefore, this novel bridgelevel T-j estimation method has a good commercial prospect.
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收藏
页码:16728 / 16738
页数:11
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