Pure copper layer coating with multi beam laser metal deposition system with blue diode laser

被引：0

作者：

Fujio, Shumpei ^{[1
]}

Yoshida, Tamaki ^{[2
]}

Yamamoto, Kosei ^{[1
]}

Takenaka, Keisuke ^{[3
]}

Sato, Yuji ^{[3
]}

Morimoto, Kento ^{[4
]}

Tsukamoto, Masahiro ^{[3
]}

机构：

[1] Osaka Univ, Grad Sch Engn, 2-1 Yamadaoka, Suita, Osaka 5650871, Japan

[2] Osaka Univ, Sch Engn, 2-1 Yamadaoka, Suita, Osaka 5650871, Japan

[3] Osaka Univ, Joining & Welding Res Inst, 11-1 Mihogaoka, Ibaraki, Osaka 5670047, Japan

[4] OSAKA FUJI Corp, 1-9-1 Jyokoji, Amagasaki, Hyogo 6600811, Japan

来源：

LASER APPLICATIONS IN MICROELECTRONIC AND OPTOELECTRONIC MANUFACTURING, LAMOM XXIX | 2024年 / 12872卷

关键词：

copper; laser metal deposition; blue diode laser; stainless-steel; multi-beam; hatching distance; STAINLESS-STEEL; PARTICLE-SIZE;

D O I：

10.1117/12.3002317

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A pure copper layer was produced on a stainless-steel type 304 substrate by using a multi-beam laser metal deposition method with blue diode lasers (B-LMD) to add the antibacterial and virus inactivation effect of pure copper on a high-strength and cost efficient material. To make a copper layer on a substrate by LMD method, beads must be formed continuously at specific intervals and each fabricated bead must be overlapped on the substrate. In this study, to fabricate a high-quality copper layer on a SS304 substrate, the effect of hatching distance (distance between each bead) was investigated. The copper layer was fabricated on the SS304 substrate with a multi-beam B-LMD method at the spot size of 233 mu m varying the hatching distance. After the copper coating process, the surface roughness and cross-section of the copper layer were observed. As a result, the surface roughness became high and a large amount of voids were formed inside the layer when the hatching distance was under 150 mu m. On the other hand, dilution of copper and SS304 increased as the hatching distance increased.

引用

页数：6