Sustainable strategies for recovering metallic copper from waste printed circuit boards: Clean leaching and micro-nano copper powder preparation

Recovery and utilization of valuable metals from waste printed circuit boards (WPCBs) have the dual significance of alleviating resource shortages and protecting the ecological environment. This study focuses on the feasibility analysis of copper in WPCBs for preparing micro-nano copper powders by clean leaching and chemical reduction processes. Firstly, the effect of temperature and other parameters on copper leaching rate in glycine-hydrogen peroxide (Gly-H2O2), ammonia-ammonium chloride (NH3 center dot H2O-NH4Cl) leaching systems with sulfuric acidhydrogen peroxide (H2SO4-H2O2) system as control group were emphasized. Subsequently, the leaching characteristics of copper concentrate particles were analyzed by leaching kinetics to elucidate the leaching mechanism and apparent activation energy of copper. Finally, the micro-nano copper powders were prepared using ascorbic acid and sodium borohydride reduction system with different copper leach solutions as precursors. The micro-nano copper morphology and phase compositions were analyzed by SEM and XRD. The results show that both the Gly-H2O2 and NH3 center dot H2O-NH4Cl system can replace the H2SO4-H2O2 system to achieve efficient leaching of copper. Increasing temperature can significantly enhance the copper leaching rate. When the temperature was increased from 15 degrees C to 45 degrees C, the maximum copper leaching rate in the three systems increased from 58.13 %,71.26 %,78.26 % to 90.36 %,91.21 %,92.87 %, at - 0.074 mm for 40 min. The Avrami model accurately describes the leaching behavior of copper concentrate particles, and the copper leaching process is dominated by chemical reaction control. SEM and XRD results show that micro-nano copper particles of hundreds of nanometers are successfully prepared by both reduction systems.