An ultra-thin vapor chamber with oriented spiral woven wick for microelectronic heat dissipation

The development of microelectronic devices is severely limited by the bottleneck of heat dissipation. To address this issue, nowadays, the ultra-thin vapor chamber (UTVC) shows great potential as a new type of element for efficient heat dissipation. However, the rapid backflow of working fluid has been a difficult problem in the ultra-thin capillary wick of UTVC. Herein, an ultra-thin vapor chamber (UTVC) as thin as 0.45 mm is proposed. The novel oriented spiral woven wick (SWW) is designed for this UTVC, which proves a near linear transport of working liquid to accelerate the liquid return for two-phase circulation. The SWW demonstrates excellent superhydrophilic property and has superior capillary performance. The thermal transfer characteristics of UTVC were investigated under three typical operating conditions, namely, horizon, gravity, and anti-gravity state. Based on the design of SWW, SWW-UTVC shows excellent anti-gravity performance. The lowest thermal resistance of SWW-UTVC is 0.77 degrees C/W at 7 W under gravity state. The maximum equivalent thermal conductivity of SWW-UTVC is as high as 13553.3 W/(m center dot K) under gravity state, which is 33.9 times that of copper (about 400 W/(m center dot K)). This UTVC with the oriented spiral woven wick is an ideal element for the heat dissipation of microelectronic, especially in the extreme limited space less than 1 mm.