Investigation of the forward gate leakage current in pGaN/AlGaN/GaN HEMTs through TCAD simulations

被引:1
|
作者
Sarkar, Arghyadeep [1 ]
机构
[1] McMaster Univ, Dept Elect & Comp Engn, Hamilton, ON L8S4K1, Canada
关键词
gate leakage; pGaN; TCAD simulations; tunneling; POWER ALGAN/GAN HEMTS; THRESHOLD VOLTAGE; GAN HEMTS; METAL; GIT;
D O I
10.1088/1361-6641/ad5041
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, we examined the gate leakage characteristics of normally off pGaN/AlGaN/GaN HEMTs through a simulation study. The Fowler Nordheim Tunneling (FNT) mechanism mainly contributes to the gate leakage process as indicated by the Technology Computer-Aided Design (TCAD) simulation. However, at low bias, the FNT undercalculates the leakage current since the electric field is low in this region. This extra leakage current component at this low bias region can be attributed to the presence of surface traps. Trap-assisted tunneling current along with the FNT current can explain forward leakage characteristics of the pGaN HEMTs. Our TCAD simulations were matched with the experimental data for five devices from four different research groups to support this claim. Using TCAD simulations, we have been able to analyze several device parameters including the various potential drops inside the gate stack structure. We were able to identify some of the trap levels and compare them to the dominant defects expected to be present in the pGaN cap layer. Furthermore, we studied the effects of different device parameters on the gate leakage process in the pGaN HEMT.
引用
收藏
页数:9
相关论文
共 50 条
  • [41] Evidence of Fowler-Nordheim Tunneling in Gate Leakage Current of AlGaN/GaN HEMTs at Room Temperature
    Turuvekere, Sreenidhi
    Rawal, Dipendra Singh
    DasGupta, Amitava
    DasGupta, Nandita
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2014, 61 (12) : 4291 - 4294
  • [42] Thermal Analysis of AlN/GaN/AlGaN HEMTs grown on Si and SiC Substrate through TCAD Simulations and Measurements
    Sahoo, A. K.
    Subramani, N. K.
    Nallatamby, J-C.
    Sommet, R.
    Quere, R.
    Rolland, N.
    Medjdoub, F.
    2016 11TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2016, : 149 - 152
  • [43] AlGaN/GaN HEMTs With Low Leakage Current and High On/Off Current Ratio
    Lin, Yu-Syuan
    Lain, Yi-Wei
    Hsu, Shawn S. H.
    IEEE ELECTRON DEVICE LETTERS, 2010, 31 (02) : 102 - 104
  • [44] Gate leakage in AlGaN/GaN HEMTs and its suppression by optimization of MOCVD growth
    Zhou, YG
    Chu, RM
    Liu, J
    Chen, KJ
    Lau, KM
    Physica Status Solidi C - Conferences and Critical Reviews, Vol 2, No 7, 2005, 2 (07): : 2663 - 2667
  • [45] Effect of plasma dry etching on gate leakage of recessed AlGaN/GaN HEMTs
    Li, Chengzhan
    Pang, Lei
    Liu, Xinyu
    Huang, Jun
    Liu, Jian
    Zheng, Yingkui
    He, Zhijing
    Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, 2007, 28 (11): : 1777 - 1781
  • [46] Gate leakage reduction in AlGaN/GaN HEMTs using in situ ion treatment
    Nawaz, Muhammad Imran
    Gurbuz, Abdulkadir
    Salkim, Gurur
    Zafar, Salahuddin
    Akoglu, Busra Cankaya
    Bek, Alpan
    Ozbay, Ekmel
    ENGINEERING RESEARCH EXPRESS, 2024, 6 (03):
  • [47] Copper gate AlGaN/GaN HEMT with low gate leakage current
    Ao, JP
    Kikuta, D
    Kubota, N
    Naoi, Y
    Ohno, Y
    IEEE ELECTRON DEVICE LETTERS, 2003, 24 (08) : 500 - 502
  • [48] Low leakage current ITO Schottky electrodes for AlGaN/GaN HEMTs
    Matsuda, Keita
    Kawasaki, Takeshi
    Nakata, Ken
    Igarashi, Takeshi
    Yaegassi, Seiji
    IEICE TRANSACTIONS ON ELECTRONICS, 2008, E91C (07) : 1015 - 1019
  • [49] Gate Leakage Mechanisms in AlInN/GaN and AlGaN/GaN MIS-HEMTs and Its Modeling
    Dutta, Gourab
    DasGupta, Nandita
    DasGupta, Amitava
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (09) : 3602 - 3608
  • [50] Investigation of the Partially Recoverable Gate Leakage On Normally-OFF Schottky-type p-GaN gate AlGaN/GaN HEMTs
    Chen, Xiaomin
    Shen, Yimin
    Qin, Feilong
    IEICE ELECTRONICS EXPRESS, 2024,