High-Performance Thermal Interface Material with A Radial Filler Skeleton

Thermal Interface Materials (TIMs) are utilized in diverse electronic devices to optimize heat dissipation. They effectively enhance cooling efficiency, diminish temperature, and extend device longevity. Among the different types of TIMs, polymer-based composite materials represent a fundamental category that offers numerous advantages, including enhanced thermal performance, mechanical stability, and ease of application. The incorporation of fillers augments the heat dissipation capabilities of the composite material by facilitating efficient heat transfer from the heat source to the surrounding cooler environment. This article outlines the fabrication process of a three-dimensional, lightweight, and mechanically robust radial-oriented silicon carbide (SiC) framework through the utilization of freeze casting technique. The resulting framework exhibits a precisely oriented arrangement of thermal channels. Subsequently, paraffin wax (PA) is infused into the framework and subjected to curing, resulting in the formation of a SiC/PA composite material. The radial SiC/PA composite material exhibits a remarkable maximum thermal conductivity of 1.46 W/(m center dot K), achieved with a mere filler content of 1.77 vol%. This thermal conductivity surpasses that of pure PA matrix by a significant margin, showing an enhancement of 287.69%. Furthermore, the composite material outperforms other similar three-dimensional filler frameworks in terms of thermal conductivity. By manipulating the framework structure and modulating the phonon transmission pathway, the composite material effectively maximizes its inherent thermal conductivity even at low filler content.