A Dual-Side Deposition Technique to Mitigate Deformation in Wire Arc Additive Manufacturing

Wire Arc Additive Manufacturing (WAAM) is a widely adopted method for functional part production. This study delves into substrate deformation during WAAM deposition, revealing that lower plate thickness leads to increased Z-direction deformation due to reduced internal resistance against thermal residual stress. Experiments and simulations on 6 mm, 8 mm, and 10 mm substrates confirm that thicker substrates exhibit lower deformation, especially 10 mm ones. Consistency between experimental and simulation results validates our findings. The study analyzed the deformation resulting from dual-sided deposition on a 10 mm substrate. Simulation indicated minimal deformation, measuring 0.02 mm (compared to 0.17 mm from single-side deposition), while experimental results showed 0.13 mm deformation (compared to 0.28 mm from single-side deposition). This demonstrates its effectiveness in minimizing deformation by neutralizing residual stress effects on both sides of substrate. A case study demonstrated sacrificial material deposition on one side of the substrate, achieving symmetrical geometry that countered residual stress. This research contributes valuable insights for material deposition and processing, emphasizing the role of substrate thickness and the potential of dual-sided deposition for deformation control.