Isotope interface engineering for thermal transport suppression in cryogenic graphene

被引:2
|
作者
Wu, Xin [1 ,2 ]
Wu, Yunhui [1 ]
Huang, Xin [1 ]
Fan, Zheyong [3 ]
Volz, Sebastian [1 ,4 ]
Han, Qiang [2 ]
Nomura, Masahiro [1 ]
机构
[1] Univ Tokyo, Inst Ind Sci, Tokyo 1538505, Japan
[2] South China Univ Technol, Sch Civil Engn & Transportat, Dept Engn Mech, Guangzhou 510640, Guangdong, Peoples R China
[3] Bohai Univ, Coll Phys Sci & Technol, Jinzhou 121013, Peoples R China
[4] Univ Tokyo, Lab Integrated Micro & Mechatron Syst, CNRS IIS UMI 2820, Tokyo 1538505, Japan
基金
中国国家自然科学基金;
关键词
Cryogenic thermal properties; Graphene; Isotope interface; Golomb ruler; 2-DIMENSIONAL MATERIALS; IRREVERSIBLE-PROCESSES; CONDUCTIVITY; INTERFERENCE; DYNAMICS;
D O I
10.1016/j.mtphys.2024.101500
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The development of emerging technologies, such as quantum computing and semiconductor electronics, emphasizes the growing significance of thermal management at cryogenic temperatures. Herein, by designing isotope interfaces based on the Golomb ruler, we achieved effective suppression of the phonon thermal transport of cryogenic graphene. The pronounced disordering of the Golomb ruler sequence results in the stronger suppression of thermal transport compared to other sequences with the same isotope doping ratio. We demonstrated that the Golomb ruler-based isotope interfaces have strong scattering and confinement effects on phonon transport via extensive molecular dynamics simulations combined with wave packet analysis, with a proper correction for the missing quantum statistics. This work provides a new stream for the design of thermal transport suppression under cryogenic conditions and is expected to expand to other fields.
引用
收藏
页数:8
相关论文
共 50 条
  • [31] NUMERICAL MODELING OF HEAT TRANSFER AND BINDING BEHAVIOR ACROSS THE INTERFACE BETWEEN EPOXY AND GRAPHENE IN THERMAL INTERFACE MATERIALS
    Wang, Yu
    HEAT TRANSFER RESEARCH, 2021, 52 (11) : 1 - 11
  • [32] Noncuring Graphene Thermal Interface Materials for Advanced Electronics
    Naghibi, Sahar
    Kargar, Fariborz
    Wright, Dylan
    Huang, Chun Yu Tammy
    Mohammadzadeh, Amirmahdi
    Barani, Zahra
    Salgado, Ruben
    Balandin, Alexander A.
    ADVANCED ELECTRONIC MATERIALS, 2020, 6 (04):
  • [33] Thermal Transport in Graphene-Polymer Nanocomposites
    Wang, Mingchao
    Galpaya, Dilini
    Lai, Zheng Bo
    Xu, Yanan
    Yan, Cheng
    FOURTH INTERNATIONAL CONFERENCE ON SMART MATERIALS AND NANOTECHNOLOGY IN ENGINEERING, 2013, 8793
  • [34] On the importance of collective excitations for thermal transport in graphene
    Gill-Comeau, Maxime
    Lewis, Laurent J.
    APPLIED PHYSICS LETTERS, 2015, 106 (19)
  • [35] Surface and Interface Engineering of Graphene Oxide Films by Controllable Photoreduction
    Liu, Yu-Qing
    Zhang, Yong-Lai
    Liu, Yan
    Jiang, Hao-Bo
    Han, Dong-Dong
    Han, Bing
    Feng, Jing
    Sun, Hong-Bo
    CHEMICAL RECORD, 2016, 16 (03) : 1244 - 1255
  • [36] Thermal transport enhancement resolution for graphene/Si and graphene/ SiC interfaces
    Tang, Yunqing
    Zhang, Zhang
    Li, Lin
    Guo, Juan
    Yang, Ping
    INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2022, 171
  • [37] Graphene-Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials
    Shahil, Khan M. F.
    Balandin, Alexander A.
    NANO LETTERS, 2012, 12 (02) : 861 - 867
  • [38] Cryogenic thermal transport properties from accelerated first-principles calculations: Role of boundary and isotope scattering
    Zhang, Xinyu
    Shao, Cheng
    Bao, Hua
    PHYSICAL REVIEW B, 2024, 110 (22)
  • [39] Compounded effect of vacancy on interfacial thermal transport in diamond-graphene nanostructures
    Loh, G. C.
    Teo, E. H. T.
    Tay, B. K.
    DIAMOND AND RELATED MATERIALS, 2011, 20 (08) : 1137 - 1142
  • [40] Thermal transport across graphene/SiC interface: effects of atomic bond and crystallinity of substrate
    Li, Man
    Zhang, Jingchao
    Hu, Xuejiao
    Yue, Yanan
    APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2015, 119 (02): : 415 - 424