Synergistic effect of Sn plus Sc on high temperature strengthening in Al-5Cu heat-resistant alloy

被引：1
作者：
Yin, Zhi [1 ]
Mao, Hongkui [1 ]
Wang, Mingjie [2 ]
Yang, Baoguo [1 ]
Yang, Chenglong [3 ]
Xu, Hong [1 ]
机构：
[1] North Univ China, Sch Mat Sci & Engn, Taiyuan 030051, Shanxi, Peoples R China
[2] Huanghuai Univ, Sch Intelligent Mfg, Zhumadian, Henan, Peoples R China
[3] Shanxi Diesel Engine Ind Co Ltd, Foundry Dept, Datong, Shanxi, Peoples R China
来源：
MATERIALS SCIENCE AND TECHNOLOGY | 2025年 / 41卷 / 01期
关键词：
Al-Cu alloy; microstructure evolution; Sn; Sc; heat-resistant; AL-CU ALLOYS; MECHANICAL-PROPERTIES; PHASE; MICROSTRUCTURE; SEGREGATION; BEHAVIOR; SB; SI;
D O I：
10.1177/02670836241249251
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
By adding Sn and Sc alone or in combination, as well as conducting a tensile test at 573 K, the synergistic effect of Sn + Sc on high-temperature strengthening in Al-5Cu heat-resistant alloy was investigated. Transmission electron microscope, elements mapping and first-principle calculations were used to characterise the microstructure evolution of the precipitation particles at various states to uncover the processes for high-temperature strengthening. It has been discovered that adding Sn and Sc, either individually or together, can significantly improve the mechanical properties of Al-Cu alloy at elevated temperatures. Among them, the alloy performance under short-time 573 K exposure can be maximised when Sn and Sc elements are added together.
引用
收藏
页码：31 / 43
页数：13
相关论文
共 36 条
[1]   Structure and precipitation hardening response in a cast and wrought Al-Cu-Sn alloy [J].
Akopyan, T. K. ;
Shurkin, P. K. ;
Letyagin, N. V. ;
Milovich, F. O. ;
Fortuna, A. S. ;
Koshmin, A. N. .
MATERIALS LETTERS, 2021, 300
[2]   Effects of small Er addition on the microstructural evolution and strength properties of an Al-Cu-Mg-Ag alloy aged at 200 °C [J].
Bai, Song ;
Huang, Tiantian ;
Xu, He ;
Liu, Zhiyi ;
Wang, Jian ;
Yi, Xinlei .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 766
[3]   Strength and stability through variable micro segregation behaviour of Ta and Zr solutes at intermetallic interfaces in Al-Cu alloys [J].
Bansal, Ujjval ;
Singh, Mahander Pratap ;
Sinha, Shyam Kanta ;
Sahu, Dhanendra Kumar ;
Mondol, Sukla ;
Makineni, Surendra Kumar ;
Paul, Aloke ;
Chattopadhyay, Kamanio .
ACTA MATERIALIA, 2023, 259
[4]   Structure evolution in dilute Al(Cu) alloys observed by 63Cu NMR [J].
Bastow, TJ ;
Celotto, S .
ACTA MATERIALIA, 2003, 51 (15) :4621-4630
[5]   Structure and heat resistance of high strength Al-3.3%Cu-2.5%Mn-0.5%Zr (wt%) conductive wire alloy manufactured by electromagnetic casting [J].
Belov, N. A. ;
Akopyan, T. K. ;
Korotkova, N. O. ;
Shurkin, P. K. ;
Timofeev, V. N. ;
Raznitsyn, O. A. ;
Sviridova, T. A. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2022, 891
[6]   The magic thicknesses of θ′ precipitates in Sn-microalloyed Al-Cu [J].
Bourgeois, Laure ;
Dwyer, Christian ;
Weyland, Matthew ;
Nie, Jian-Feng ;
Muddle, Barrington C. .
ACTA MATERIALIA, 2012, 60 (02) :633-644
[7]   Effect of interfacial solute segregation on ductile fracture of Al-Cu-Sc alloys [J].
Chen, B. A. ;
Liu, G. ;
Wang, R. H. ;
Zhang, J. Y. ;
Jiang, L. ;
Song, J. J. ;
Sun, J. .
ACTA MATERIALIA, 2013, 61 (05) :1676-1690
[8]   Atomic structures of interfacial solute gateways to θ′ precipitates in Al-Cu alloys [J].
Chisholm, M. F. ;
Shin, D. ;
Duscher, G. ;
Oxley, M. P. ;
Allard, L. F. ;
Poplawsky, J. D. ;
Shyam, A. .
ACTA MATERIALIA, 2021, 212
[9]   Microstructure, mechanical properties and corrosion behavior of Al-Si-Cu-Zn-X (X=Bi, Sb, Sr) die cast alloy [J].
Farahany, Saeed ;
Ourdjini, Ali ;
Bakhsheshi-Rad, Hamid Reza .
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2016, 26 (01) :28-38
[10]   The growth mechanisms of θ′ precipitate phase in an Al-Cu alloy during aging treatment [J].
Gao, Lin ;
Li, Kai ;
Ni, Song ;
Du, Yong ;
Song, Min .
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2021, 61 :25-32
1234