Heavy-Ion Radiation Effects in AlGaN/GaN High-Electron-Mobility Transistors

被引:8
作者
Gao, Han [1 ]
Asadi, Reza Farsad [1 ]
Wang, Menglin [1 ]
Zheng, Tao [1 ]
Gnade, Bruce [2 ]
Baumann, Robert [2 ]
机构
[1] Southern Methodist Univ, Dept Elect Engn, Dallas, TX 75205 USA
[2] Univ Texas Dallas, North Texas Semicond Inst, Richardson, TX 75080 USA
关键词
Logic gates; Electric breakdown; HEMTs; Ions; Dielectrics; Degradation; Testing; AlGaN/gallium nitride (GaN) high-electron-mobility transistor (HEMT); defect-assisted breakdown; destructive single-event effects (SEEs); gate dielectric degradation; hard breakdown (HBD); heavy-ion radiation; single-event gate rupture; soft breakdown (SBD); INDUCED LEAKAGE CURRENT; GATE OXIDES; HARD BREAKDOWN; CAPACITORS; SOFT;
D O I
10.1109/TNS.2024.3370970
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Heavy-ion radiation tolerance of wide-bandgap gallium nitride (GaN) high-electron-mobility transistors (HEMTs) has been studied as a function of bias voltage, ion linear energy transfer (LET), radiation flux, and total fluence. A statistically significant number of heavy-ion-induced gate dielectric breakdowns were observed, including both soft breakdown (SBD) and hard breakdown (HBD) events. Specific fluence-to-failure experiments and constant-fluence experiments were used to explore the gate dielectric degradation mechanism. Our data provide evidence that radiation-induced breakdown is associated with defect-related conduction paths formed across the dielectric in response to radiation-induced charge injection.
引用
收藏
页码:902 / 911
页数:10
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