Improved HF-FOM and SC Ruggedness of Split-Gate 4H-SiC MOSFET With P plus Buffer

被引:1
作者
Chen, Yuzhi [1 ]
Li, Chi [1 ]
Wu, Yifan [1 ]
Zheng, Zedong [1 ]
机构
[1] Tsinghua Univ, Dept Elect Engn, State Key Lab Power Syst, Beijing 100084, Peoples R China
基金
北京市自然科学基金;
关键词
SiC MOSFETs; short-circuit withstand time; high-frequency figure of merit (HF-FOM); device reliability;
D O I
10.1109/LED.2024.3401043
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this letter, a novel Split-Gate SiC MOSFET is proposed by introducing a P+ buffer (SG-PB-MOS) into the JFET region. The P+ buffer serves to enhance device oxide reliability by mitigating the peak oxide electric field (E-max) . Besides, the P+ buffer facilitates depletion of the JFET region under high drain voltage, suppressing the short-circuit current. The SG-PB-MOS, Split-Gate MOSFET (SG-MOS), and conventional MOSFET (C-MOS) are systematically characterized through TCAD simulations. Cell-level parameter distributions are observed and analyzed to validate the efficacy of the proposed structure. In blocking states, the SG-PB-MOS demonstrates the mildest Emax . Moreover, compared to the C-MOS and SG-MOS, the SG-PB-MOS exhibits a 1.5x and 2.1x improvement in short-circuit withstand time (SCWT), a 5.2x and 2.4x improvement in high-frequency figure-of-merit (HF-FOM, R-on x Q(gd)) , respectively. Notably, these enhancements are achieved with negligible impact on R-on. As a result, SG-PB-MOSFET shows superior trade-offs in both R-on & E-max, Ron & SCWT, and R-on & Q(gd), making it suitable for high reliability and high power-density applications.
引用
收藏
页码:1269 / 1272
页数:4
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