共 50 条
- [41] A physical based fatigue model for the micro solder joint in the 3D electronic packagin 2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
- [45] Design of Hierarchal 3D Metal Oxide Structures for Water Oxidation and Purification ADVANCED SUSTAINABLE SYSTEMS, 2018, 2 (04):
- [46] Electrodeposition of Au for self-assembling 3D micro-structures MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY XIII, 2008, 6882
- [47] Persistent homology reveals strong phylogenetic signal in 3D protein structures PNAS NEXUS, 2024, 3 (04):
- [49] High throughput, precision laser milling for arbitrary 3D structures in silicon LASER PLUS PHOTONICS FOR ADVANCED MANUFACTURING, 2024, 13005