Dynamic Thermal Response of Multiple Interface Cracks between a Half-Plane and a Coating Layer under General Transient Temperature Loading

被引:1
作者
Nourazar, Mahsa [1 ]
Yang, Weilin [1 ]
Chen, Zengtao [1 ]
机构
[1] Univ Alberta, Dept Mech Engn, Edmonton, AB T6G 1H9, Canada
关键词
multiple-crack problems; interface cracks; non-Fourier heat conduction; dislocation technique; thermal loading; singular integral equations; HYPERBOLIC HEAT-CONDUCTION; FRACTURE;
D O I
10.3390/ma17112478
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
This paper explores the thermal behavior of multiple interface cracks situated between a half-plane and a thermal coating layer when subjected to transient thermal loading. The temperature distribution is analyzed using the hyperbolic heat conduction theory. In this model, cracks are represented as arrays of thermal dislocations, with densities calculated via Fourier and Laplace transformations. The methodology involves determining the temperature gradient within the uncracked region, and these calculations contribute to formulating a singular integral equation specific to the crack problem. This equation is subsequently utilized to ascertain the dislocation densities at the crack surface, which facilitates the estimation of temperature gradient intensity factors for the interface cracks experiencing transient thermal loading. This paper further explores how the relaxation time, loading parameters, and crack dimensions impact the temperature gradient intensity factors. The results can be used in fracture analysis of structures operating at high temperatures and can also assist in the selection and design of coating materials for specific applications, to minimize the damage caused by temperature loading.
引用
收藏
页数:13
相关论文
共 29 条