Strengthened and toughened SiHfBCN-based high-temperature resistant adhesive with SiC NWs

To further improve the performance of binders, a SiHfBCN-based high-temperature resistant adhesive was successfully synthesized by Polymer-Derived Ceramics (PDC) route using TiB2, Polysiloxane (PSO) and short SiC nanowires as fillers. The effect of short SiC nanowires on the adhesive strength at room temperature and high temperature, as well as the reinforcing mechanism was studied. Compared with the adhesive without SiC nanowires, after curing (at 170 degrees C) and pyrolysis (at 1000 degrees C) in air, the appropriate adding of SiC nanowires upgrades the room temperature and high temperature (at 1000 degrees C in air) adhesive strength to (12.50 +/- 0.67) MPa (up by about 32%) and (13.11 +/- 0.79) MPa (up by about 106%), respectively. Attractively, under the synergistic impact of the nanowire bridging, nanowire breaking, nanowire drawing and crack deflection, the optimized adhesive exhibits multi-stage fracture, causing the increscent fracture displacement. (c) 2024 Production and hosting by Elsevier Ltd. on behalf of Chinese Society of Aeronautics and Astronautics. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/ licenses/by-nc-nd/4.0/).