A Novel Band-pass Filter in Ka Band with SiP Packaging

被引：0
|
作者：
Qin, Junjie [1 ]
Wang, Han [1 ]
Chen, Danyang [1 ]
Zhu, Cheng [1 ]
Wang, Guanglai [1 ]
Yang, Daoguo [1 ]
机构：
[1] Guilin Univ Elect Technol, Sch Mech & Elect Engn, Guilin, Peoples R China
来源：
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2023年
关键词：
System in package; substrate integrated cavity; Band-pass filter; Ka-band; DESIGN;
D O I：
10.1109/ICEPT59018.2023.10492201
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
To enhance the reliability of signal transmission in a system in package, this paper proposes a band-pass filter based on the system in package. The filter operates in the Ka band and employs a multi-layer substrate structure with circular cavities stacked together to reduce its size while maintaining performance. By changing the slot size to form coupling between the two resonators, the filter becomes simpler and easier to manufacture, making it suitable for systems in packages with a center frequency of 34 GHz. In the passband of 6 GHz, the insertion loss is less than 0.38 dB, ensuring minimal distortion in the transmitted signal, while the return loss is greater than 11dB, providing ample protection against interference and noise. Overall, this band-pass filter offers a reliable solution for enhancing signal transmission in system in packages, making it an ideal choice for various applications requiring high-performance filters.
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页数：5
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