Hybrid-integrated 200 Gb/s REC-DML array transmitter based on photonic wire bonding technology

An 8-channel hybrid-integrated chip for 200 Gb/s (8 × 25 Gb/s) signal transmission has been demonstrated. The channels are all within the O-band, and with a spacing of 800 GHz. The core of this chip is a monolithic integrated multi-wavelength laser array of 8 directly-modulated distributed feedback(DFB) lasers. By using the reconstruction equivalent chirp technique, multi-wavelength integration and asymmetric phase shift structures are achieved in the laser array. The output laser beams of the array are combined by a planar light-wave circuit, which is hybrid-integrated with the laser array by photonic wire bonding. Experiment results of this transmitter chip show good single-mode working of each unit laser, with a sidemode suppression ratio above 50 dB, and the modulation bandwidth is above 20 GHz. Clear eye diagrams are obtained in the lasers for 25 Gb/s non-return-to-zero modulation, which implies a total 200 Gb/s transmission rate for the whole chip.