High-Performance All-Printed Flexible Micro-Supercapacitors with Hierarchical Encapsulation

被引：0

作者：

Yuhang Yuan ^{[1
]}

Wei Yuan ^{[1
]}

Yaopeng Wu ^{[1
]}

Xuyang Wu ^{[1
]}

Xiaoqing Zhang ^{[1
]}

Simin Jiang ^{[1
]}

Bote Zhao ^{[2
]}

Yu Chen ^{[2
]}

Chenghao Yang ^{[2
]}

Liangxin Ding ^{[3
]}

Zhenghua Tang ^{[2
]}

Yingxi Xie ^{[1
]}

Yong Tang ^{[1
]}

机构：

[1] School of Mechanical & Automotive Engineering, South China University of Technology

[2] School of Environment and Energy, South China University of Technology

[3] School of Chemistry and Chemical Engineering, South China University of

来源：

Energy & Environmental Materials | 2024年 / 7卷 / 04期

关键词：

D O I：

暂无

中图分类号：

TM53 [电容器]; TS805 [印刷技术];

学科分类号：

摘要：

<正>Printed micro-supercapacitors (MSCs) have shown broad prospect in flexible and wearable electronics.Most of previous studies focused on printing the electrochemically active materials paying less attention to other key components like current collectors and electrolytes.This study presents an allprinting strategy to fabricate in-plane flexible and substrate-free MSCs with hierarchical encapsulation.

引用

页码：262 / 268

页数：7

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