Quality and Reliability Evolution of Electronic Components

被引：0

作者：

Băjenescu T.-M.I. ^{[1
]}

机构：

[1] Prof. Eng., Doctor Honoris Causa of Military Technical Academy of Romania and of Technical, University of Republic of Moldova, Chișinău

来源：

EEA - Electrotehnica, Electronica, Automatica | 2022年 / 70卷 / 02期

关键词：

effects of environment; environmental stress screening ESS; nanopackaging; Process reliability; reliability centred maintenance RCM; stressor; susceptibility analysis;

D O I：

10.46904/eea.22.70.2.1108001

中图分类号：

学科分类号：

摘要：

Today, most of the companies understand that the reliability must be built in at the design phase and then, monitored during the whole manufacturing process. Reliability building means the totality of techniques and procedures having the goal to ensure a foreseen reliability level for a given product. This concept is linked with reliability assessing, which cover the whole evaluation system aiming to find out and record, during and after the manufacturing process, the reliability level of the batch of products. This evaluation system contains tests, electrical measurements, failure analysis and statistical processing of data. © 2022, Editura ELECTRA. All rights reserved.

引用

页码：01 / 08

页数：7

共 27 条

[1]

Taguchi G., Clausing D., Robust Quality, Harvard Business Review, 1, pp. 65-75, (1990)

[2]

PTC White Paper

[3]

Sarno E., Et al., A Hybrid Methodology for Enhancing Reliability of Large Systems in Conceptual Design and its Application to the Design of a Multiphase Flow Station, Research in Engineering Design, 16, pp. 27-41, (2005)

[4]

Wu Y.-F., Saxler A., Moore M., Smith R.P., Sheppard S., Chavarkar P.M., Wisleder T., Mishra U.K., Parikh P., Electron Dev. Lett, 25, (2004)

[5]

Lasance C. J. M., Temperature and Reliability in Electronics Systems – the Missing Link

[6]

Humphrey D., Condra L., Pends N., Das D., Wilkinson C., Pecht M., An Avionics Guide to Uprating of Electronic Parts, IEEE Trans. CPMT, Part A, 23, 3, pp. 595-599, (2000)

[7]

Jackson M., Lall P., Das D., Thermal Derating – A Factor of Safety or Ignorance, IEEE Trans. CPMT, Part A, 20, 1, pp. 83-85, (1997)

[8]

Murray F., Building Smaller, More Reliable Medical Electronic Devices, European Medical Device Technology, 2, 9, (2011)

[9]

Proton Irradiated HEMT for More Reliable Computers and Other Electronic Devices

[10]

Bazu M., Bajenescu T.-M., Failure Analysis. A practical guide for manufacturers of electronic components and systems, (2011)

← 1 2 3 →