Effects of one special-shaped pin fin on the flow and heat transfer performance in the liquid cooling plate for a battery pack

被引:2
|
作者
Zhang, Yong [1 ]
Pan, Shengong [1 ]
Liu, Shuichang [1 ]
Liu, He [1 ]
Tian, Chengchun [1 ]
Hu, Jian [1 ]
机构
[1] Hunan Univ Technol, Dept Mech Engn, Zhuzhou 412007, Peoples R China
关键词
Special-shaped pin fin; Comprehensive performance coefficient; Battery pack; Liquid cooling plate; Temperature uniformity; LITHIUM; MANAGEMENT; MICROCHANNEL; ENHANCEMENT; CHANNELS; ISSUES; POWER;
D O I
10.1016/j.ijthermalsci.2023.108643
中图分类号
O414.1 [热力学];
学科分类号
摘要
In order to develop the liquid cooling plate of the battery pack with high efficiency, low resistance and uniform temperature, a special-shaped pin fin was proposed, and the influence mechanism of its structure and arrangement parameters on the flow and heat transfer performance in the flow channel of the liquid cooling plate is investigated numerically, and the temperature uniformity coefficient was used to quantify the distribution of temperature to verify the comprehensive heat dissipation performance. The results show that the arrangement of the pin fin disturbs the flow in the channel and increases the flow velocity near the upper surface of the channel, which is beneficial to enhance heat dissipation and increases the flow resistance at the same time; When the parameters of structure and layout of the pin fin are in a certain range, the comprehensive performance coefficient TP of the flow in the channel is greater than 1, in other words, the combined performance of the flow in the channel is improved. When the height ratio is 0.7, the width-length ratio is 0.5, the width ratio is 0.3, and the spacing ratio is 1.0, the TP of flow heat transfer in the flow channel is the best, and when Re = 1000, the TP of flow heat transfer is improved by 58%; When this pin fin is applied to the serpentine channel of the cooling plate of an in-use engineering vehicle, the highest temperature of the cooling plate is reduced by 3.5 K, the temperature difference is reduced by 3.5 K. The temperature uniformity coefficient is reduced by 56%, that is the heat dissipation performance of the liquid cooling plate can be improved comprehensively after adding the pin fin.
引用
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页数:12
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