Reliability in Electronic Packaging: Past, Now and Future

被引：0

作者：

Chen Z. ^{[1
]}

Mei Y. ^{[2
]}

Liu S. ^{[1
,3
]}

Li H. ^{[1
]}

Liu L. ^{[4
]}

Lei X. ^{[3
]}

Zhou Y. ^{[3
]}

Gao X. ^{[3
]}

机构：

[1] Institute of Technological Sciences, Wuhan University, Wuhan

[2] School of Materials Science and Engineering, Tianjin University, Tianjin

[3] School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan

[4] School of Materials Science and Engineering, Wuhan University of Technology, Wuhan

来源：

Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2021年 / 57卷 / 16期

关键词：

Electronic packaging; Failure mechanisms; Integrated circuit; LED; Modeling; Packaging materials; Power devices; Reliability;

D O I：

10.3901/JME.2021.16.248

中图分类号：

学科分类号：

摘要：

Electronic packaging is the key step that make chips become functional devices. Many different types of materials are involved in this step, majority of which show non-linear mechanical behaviors with significant temperature dependency and strain rate dependency. During the processes, the interactions between loads from the environment and devices are multi-scale and multi-physics in nature. This also poses new requirements on modeling and simulation techniques in electronic packaging. As for reliability validation, typical failure modes in electronic packaging include thermal-mechanical coupling failure and electrical-thermal-mechanical coupling failure and so on. With the development of new packaging materials and technologies, new approaches are in demand in experimental methodology and modeling and co-design techniques. © 2021 Journal of Mechanical Engineering.

引用

页码：248 / 268

页数：20

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