Passive enhanced heat transfer, hotspot management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review

As electronic devices continue to develop towards miniaturization and high integration. Microchannel heat sinks (MCHSs) have received widespread attention in the heat dissipation of high heat flux electronic devices due to their large surface -to -volume ratio, compact structure, and excellent thermal performance. The limited heat transfer capacity of traditional microchannel heat sinks, high -temperature gradients along the flow direction, and the generation of local hot spots have become major challenges for the efficient operation and longevity of electronic components. In response to these issues, researchers have been working to design and improve microchannel heat sinks in recent years. Therefore, this article summarizes the heat transfer and flow characteristics of various enhanced structures of single-phase flow microchannel heat sinks, providing direction for exploring high heat transfer capacity and low-pressure drop loss combination structures. In addition, it summarizes methods for hot spot management and reducing temperature distribution unevenness in single-phase flow microchannel heat sinks. Finally, reasonable suggestions are made for future research directions and ideas for microchannel heat sinks.