Thermophysical properties of SiC particles reinforced graphite flakes/Al composites

被引：0
|
作者：
Zeng F. [1 ,2 ]
Meng Z. [1 ,2 ]
Guo W. [1 ,2 ]
机构：
[1] Hubei Key Laboratory of Advanced Technology for Automotive Components, Wuhan University of Technology, Wuhan
[2] Hubei Collaborative Innovation Center for Automotive Components Technology, Wuhan University of Technology, Wuhan
来源：
Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica | 2022年 / 39卷 / 10期
关键词：
Coefficient of thermal expansion; Composite; Flexure strength; SiC-graphite flakes/Al; Thermal conductivity;
D O I：
10.13801/j.cnki.fhclxb.20211103.004
中图分类号：
学科分类号：
摘要：
The graphite flakes/Al composite has the advantages of low density and high thermal conductivity, but it cannot be used as a kind of commercial electronic packaging material due to its poor mechanical properties at present. In order to improve the thermophysical properties of graphite flakes/Al composite, the SiC particles reinforced graphite flakes/Al composites were prepared via vacuum hot-pressing process. The effect of the different content of SiC on the thermal conductivity, coefficient of thermal expansion, and flexure strength of the SiC-graphite flakes/Al composites were studied. The result shows that the high-frequency vibration process contributes to the good orientation of graphite flakes in the composites. The SiC particles can significantly reduce the coefficient of thermal expansion, increase the flexure strength, and slightly decrease the thermal conductivity of the composites. However, as the volume fraction of SiC particles increases, many pores and defects are gradually foamed in the SiC-graphite flakes/Al composites, causing the decrease of the relative density. When the volume fraction of SiC and graphite flakes are 15vol% and 50vol%, respectively, the thermal conductivity in x-y plane, coefficient of thermal expansion and flexure strength of the SiC-graphite flakes/Al composite are 536 W/(m·K) and 6.4×10-6 m/K and 102 MPa, respectively, exhibiting the best comprehensive thermophysical properties, which can be a kind of electronic packaging material with very commercial prospect. © 2022, Editorial Office of Acta Materiae Compositae Sinica. All right reserved.
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页码：4918 / 4926
页数：8
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