Effect of Molecular Weight of Pressure-sensitive Adhesive to Peeling Phenomenon between Adhesive and Silicon Wafer by Molecular Dynamics Simulations

被引：0
作者：
Iwakata Y. [1 ]
Izumi S. [2 ]
机构：
[1] Lintec Corporation, Tsuji, Minami-ku, Saitama
[2] Department of Mechanical Engineering, Graduate Shool of Engineering, University of Tokyo, Bunkyo-ku, Tokyo
来源：
Zairyo/Journal of the Society of Materials Science, Japan | 2022年 / 71卷 / 02期
基金：
日本学术振兴会;
关键词：
Adhesives; Cross-linked structure; Molecular dynamics; Molecular weight; Peeling; Polymer;
D O I：
10.2472/jsms.71.143
中图分类号：
学科分类号：
摘要：
We have investigated the peeling behavior between pressure-sensitive adhesive and silicon wafer by using molecular dynamics method. Our aim is to clarify the effect of the molecular weight of adhesives to the peeling behavior. We have conducted peeling simulations with various molecular weight of adhesives and various surface roughness of silicon substrate as modeled by amorphous SiO2. We focus on the stress-displacement curve, the maximum value of peeling stress and the energy required for the peeling. It was found that the larger molecular weight and larger surface roughness induced larger peeling energy. Peeling energy is dependent on the interface bonding status. On the contrast, maximum value of peeling stress partially correlates with the molecular weight. From the detailed observation of peeling process, it was found that peeling stress is dependent on the network of adhesive molecule chains. The maximum value of the peel stress increases as the number of partial molecular chains constrained to the substrate, and the number of the partial molecular chains connected to the constrained molecular chain via increase of cross-links. In addition, the number of interfaces of the connected partial molecular chain increases the maximum peeling stress. Our results provide a new insight to the design of adhesive. ©2022 The Society of Materials Science, Japan
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页码：143 / 150
页数：7
相关论文
共 19 条
  • [1] Morita H., Yamada M., Yamaguchi T., Doi M., Molecular dynamics study of the adhesion between end-grafted polymer films, Polymer Journal, 37, 10, pp. 782-788, (2005)
  • [2] Anastassiou A., Mavrantzas V. G., Molecular structure and work of adhesion of poly(n-butyl acrylate) and poly(n-butyl acrylate-Co-acrylic acid) on α-quartz, αferric oxide, and α-ferrite from detailed molecular dynamics simulations, Macromolecules, 48, 22, pp. 8262-8284, (2015)
  • [3] Jin K., Lopez Barreiro D., Martin-Martinez F. J., Qin Z., Hamm M., Paul C. W., Buehler M. J., Improving the performance of pressure sensitive adhesives by tuning the crosslinking density and locations, Polymer, 154, 10, pp. 164-171, (2018)
  • [4] Lopez Barreiro D., Jin K., Martin-Martinez F. J., Qin Z., Hamm M., Paul C. W., Buehler M. J., Molecular dynamics study of the mechanical properties of polydisperse pressure-sensitive adhesives, International Journal of Adhesion and Adhesives, 92, 7, pp. 58-64, (2019)
  • [5] Qin Z., Jin K., Buehler M. J., Molecular modeling and mechanics of acrylic adhesives on a graphene substrate with roughness, Bionanoscience, 6, 3, pp. 177-184, (2016)
  • [6] Yamamoto S., Kuwahara R., Aoki M., Shundo A., Tanaka K., Molecular events for an epoxy-amine system at a copper interface, Applied Polymer Mateirials, 2, 4, pp. 1474-1481, (2020)
  • [7] Takamoto S., Yamasaki T., Nara J., Ohno T., Kaneta C., Hatano A., Izumi S., Atomistic mechanism of graphene growth on a SiC substrate: Large-scale molecular dynamics simulations substrate on a new charge-transfer bond-order type potential, PHYSICAL REVIEW B, 97, 12, pp. 1-8, (2018)
  • [8] Scheerschmidt K., Conrad D., Belov A., Timpel D., Enhanced semi-empirical potentials in molecular dynamics simulations of wafer bonding, Materials Science in Semiconductor Processing, 3, pp. 129-135, (2000)
  • [9] Iwakata Y., Izumi S., Molecular dynamics study of the interaction and peeling behavior between Si wafers and pressure-sensitive adhesive, Journal of The Adhesion Society of Japan, 57, 10, (2021)
  • [10] Yagyu H., Simulations of the effects of filler aggregation and filler-rubber bond on the elongation behavior of filled cross-linked rubber by coarse-grained molecular dynamics, Soft Materials, 15, 4, pp. 263-271, (2017)
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